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TS3L301DGGRG4 is listed in the Analog Switches - Special Purpose range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC ETHERNET SWITCH 16X8 48TSSOP. Review the specifications below when checking this part for your BOM.
The TS3L301DGGRG4 is a 16-bit to 8-bit single-pole double-throw (SPDT) gigabit LAN switch manufactured by Texas Instruments. It integrates eight independent SPDT switches within a single package, designed for high-speed signal routing in network applications. The device operates with a supply voltage of 3.3 V and features a maximum on-state resistance of 8 Ohms. It supports a bandwidth of 900 MHz, ensuring minimal signal degradation at high frequencies. The component functions reliably across an extended temperature range from -40°C to +85°C. It is housed in a 48-pin Thin-Shrink Small Outline Package (TSSOP) and consumes a maximum supply current of 250 µA.
Verify the specific suffix 'RG4' confirms RoHS compliance and lead-free status as per manufacturer standards. Confirm the TSSOP-48 package dimensions match the target PCB footprint requirements. Ensure the operating temperature range meets the environmental conditions of the final assembly. Cross-reference the datasheet revision to confirm pinout consistency before integration into new designs.
Select this component when designing circuits requiring multiple SPDT switches in a limited board space. The 8-switch configuration reduces the need for discrete components compared to individual analog switches. Consider the 8 Ohm on-resistance impact on signal loss for long trace lengths. Verify that the 3.3 V supply voltage aligns with the system's power rails to avoid level shifting issues.
This part belongs to the TS3L301 series of gigabit LAN switches from Texas Instruments. The series is engineered for high-performance networking applications where signal fidelity is critical. The DGGR variant specifically denotes the TSSOP-48 package type. This family replaces older discrete switching solutions with integrated multi-channel devices.
Check for direct pin-to-pin replacements within the same TI series if availability is constrained. Verify that alternative packages maintain the same electrical characteristics and thermal performance. Ensure any substitute component supports the required 900 MHz bandwidth for gigabit applications.
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