TS68EN360VA33L

Overview

The TS68EN360 is a 32-bit Quad Integrated Communication Controller (QUICC) microprocessor featuring the CPU32+ core. It operates at system frequencies of 25 MHz and 33 MHz with a +5V supply voltage. The device integrates four Serial Communications Controllers (SCCs), two Serial Management Controllers (SMCs), and one Serial Peripheral Interface (SPI). Key specifications include a 32-bit data bus, up to 32 address lines, and a Communications Processor Module (CPM). It supports military temperature ranges from -55°C to +125°C and offers static design operation.

Feature Summary

• Integrates a CPU32+ processor core with background debug mode and byte-misaligned addressing capabilities.
• Includes a Communications Processor Module (CPM) with dual-port RAM for efficient data handling.
• Features four General-purpose Timers and two Independent DMAs (IDMAs) for system control.
• Supports multiple serial communication protocols via SCCs, SMCs, and SPI interfaces.

Applications

• High-performance embedded communication controller systems
• Military-grade electronic equipment requiring extended temperature operation
• Network interface controllers utilizing Ethernet or serial protocols
• Complex peripheral management in multi-processor architectures

Procurement Notes

Verify package configuration upon ordering, as suffixes indicate distinct physical forms: 'R' denotes a 241-lead Ceramic Pin Grid Array (PGA), while 'A' signifies a 240-lead Ceramic Leaded Chip Carrier (CERQUAD). Confirm specific screening requirements, such as MIL-STD-883 Class B or QML Class Q, as these affect qualification status. Ensure compatibility with existing system power supplies and clock configurations before integration.

Selection Notes

Select this component for applications demanding high integration of serial communication peripherals within a single chip. The CPU32+ core provides backward compatibility with legacy 68000 software while offering 32-bit performance. Consider the thermal resistance characteristics when designing heat dissipation solutions, particularly for the PGA package variant. Verify that the required operating frequency aligns with the specific silicon revision's electrical characteristics.

Part Context

The TS68EN360 belongs to the TS68300 family of QUICC devices, representing an evolution of earlier models like the TS68302. It introduces a 32-bit Intermodule Bus (IMB) and enhanced peripheral sets compared to its predecessors. Manufactured under strict military standards, it serves as a robust solution for demanding environments where reliability and comprehensive on-chip communication resources are critical.

Replacement Considerations

Direct replacements depend on package type and speed grade. The TS68EN360R33L corresponds to the 33 MHz PGA version, while the TS68EN360A33L represents the 33 MHz CERQUAD variant. Lower speed variants such as the TS68EN360R25L and TS68EN360A25L offer 25 MHz operation. Ensure pinout compatibility between PGA and CERQUAD packages if swapping form factors.

FAQ

What is the difference between the R and A suffixes in the part number?

The suffix indicates the package type. 'R' designates a 241-lead Ceramic Pin Grid Array (PGA), whereas 'A' designates a 240-lead Ceramic Leaded Chip Carrier (CERQUAD).

Does the TS68EN360 support slave mode operation?

Yes, the device can operate in Slave Mode to disable the CPU32+, allowing it to be used with external processors or as a companion chip to other masters like the TS68040.

What is the maximum power dissipation at 33 MHz?

According to the datasheet, the maximum power dissipation for the 33 MHz version is 2.00 W at a VCC of 5.25 V.