TSB1N18D845MLV0D9T

Overview

The TSB1N18D845MLV0D9T is a multilayer ceramic bandpass filter designed for RF signal conditioning. It features a center frequency of 844.5 MHz and a bandwidth of 231 MHz, with an insertion loss of 1.9 dB. The component operates within a temperature range of -40°C to +85°C and utilizes a 0603 (1.6x0.8x0.65mm) surface-mount package.

Feature Summary

• Multilayer ceramic construction for compact integration
• Bandpass filtering optimized for LTE-M and NB-IoT bands
• Surface-mount design suitable for automated assembly

Applications

• LTE-M module implementation
• NB-IoT device connectivity
• Audio/visual equipment RF stages
• Office automation equipment signal processing

Procurement Notes

Verify the complete part number including suffixes against official Taiyo Yuden documentation to ensure correct packaging and specifications. Confirm that the requested variant matches the required center frequency and bandwidth parameters for your specific circuit design before ordering.

Selection Notes

Select this component when a narrowband ceramic filter is required for sub-GHz IoT applications. Ensure the PCB layout accommodates the 0603 footprint and that the operating environment remains within the specified -40°C to +85°C thermal limits for reliable performance.

Part Context

This part belongs to Taiyo Yuden's TSB series of ceramic RF filters. These devices are engineered specifically for low-power wide-area network technologies, providing essential frequency selection in compact form factors suitable for space-constrained mobile and IoT hardware designs.

Replacement Considerations

The previous part number for this component was FI168B0845D9-T. Verify compatibility with existing board layouts if substituting from older revisions.