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TSF20U60C is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Taiwan Semiconductor Corporation. Its product description is DIODE ARR SCHOT 60V 10A ITO220AB. Review the specifications below when checking this part for your BOM.
The TSF20U60C is a Schottky rectifier manufactured by Taiwan Semiconductor Corporation. It features a maximum repetitive peak reverse voltage of 60V and an average forward rectified current rating of 20A. The device utilizes a TO-277A surface-mount package configuration. Key electrical parameters include a maximum forward voltage drop of 480mV at the rated current and a maximum reverse leakage current of 500µA at the rated voltage. The component supports a junction temperature range from -55°C to +150°C.
Verify the specific suffix codes against official manufacturer documentation to confirm exact binning or testing variations. Confirm RoHS compliance status through the latest datasheet revision. Ensure the ordering quantity aligns with standard reel packaging requirements specified by the supplier. Cross-reference the full part number with authorized distributor catalogs to validate current availability and lead times.
Select this component for applications requiring efficient rectification at low voltages. The 60V rating suits systems operating within this voltage headroom. Consider the thermal performance of the TO-277A package for heat dissipation needs. Evaluate the forward voltage characteristics against system efficiency targets. Verify that the reverse leakage specifications meet the circuit's standby power constraints.
This device belongs to the family of high-efficiency Schottky rectifiers designed for modern power conversion topologies. It replaces older technologies to improve overall system efficiency. The TO-277A form factor allows for automated assembly processes. It serves as a critical component in reducing conduction losses in synchronous and asynchronous rectifier circuits.
Check for direct pin-compatible alternatives with identical voltage and current ratings. Verify that substitute components maintain similar forward voltage and reverse leakage characteristics. Ensure the replacement package matches the existing PCB footprint and thermal pad requirements.
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