TSI572-10GCL

Overview

The TSI572-10GCL is a Serial RapidIO switch integrated circuit manufactured by Renesas Electronics Corporation. It is designed for high-performance switching applications, specifically targeting wireless infrastructure environments. The device is housed in a 399-BGA Exposed Pad package with dimensions of 21x21 mm, identified as the 399-TEPBGA supplier device package. This component facilitates data routing within complex network topologies requiring reliable serial communication protocols.

Feature Summary

• Serial RapidIO Switch functionality
• 399-TEPBGA (21x21) surface mount package

Applications

• Wireless Infrastructure

Procurement Notes

Verify the specific suffix 'CL' against official Renesas documentation to confirm temperature range and material specifications. Confirm current availability status as distribution channels may vary. Ensure handling procedures account for the exposed pad BGA package requirements during assembly.

Selection Notes

Select this component when a Serial RapidIO switch is required for wireless infrastructure systems. The 399-pin TEPBGA package dictates specific PCB layout constraints. Verify that the operating environment aligns with the device's thermal and electrical ratings defined in the manufacturer datasheet.

Part Context

This part belongs to the Renesas Serial RapidIO switch family. It serves as a networking interconnect solution for baseband processing and radio unit connections in telecommunications equipment. The 399-ball BGA form factor supports high-density signal routing necessary for multi-port switching architectures.

Replacement Considerations

Check for direct pin-to-pin replacements or upgraded generations within the Renesas portfolio. Evaluate alternative Serial RapidIO switches from other vendors if supply constraints exist, ensuring protocol compatibility and package footprint alignment.