TSI620-10GIL

Overview

The TSI620-10GILV is a Serial RapidIO switch integrated circuit manufactured by Renesas Electronics Corporation. It features a 675-ball Thin Exposed Pad Ball Grid Array (TEPBGA) package with dimensions of 27x27 mm. The device is designed for high-performance switching applications, specifically targeting wireless infrastructure environments. It supports surface mount technology for PCB integration.

Feature Summary

• Serial RapidIO Switch IC
• 675-BGA Exposed Pad Package (27x27mm)
• Surface Mount Device

Applications

• Wireless Infrastructure

Procurement Notes

Verify the exact ordering suffix against official Renesas documentation to confirm temperature range and RoHS compliance status. Confirm current production lifecycle status as components may be subject to discontinuation notices. Ensure compatibility with the specified 675-TEPBGA footprint during procurement planning.

Selection Notes

Select this component for designs requiring Serial RapidIO switching capabilities within wireless infrastructure systems. Ensure the PCB layout accommodates the 27x27mm 675-ball TEPBGA package with an exposed pad for thermal management. Verify that the system environment meets the operational requirements for this specific switch IC.

Part Context

This part belongs to the Renesas Serial RapidIO switch family. It serves as a specialized interconnect solution for high-speed data routing in communication equipment. The TSI620 variant provides specific port configurations and performance characteristics tailored for infrastructure networking tasks.

Replacement Considerations

Consult official Renesas cross-reference documents for verified pin-to-pin or functional replacements. Generic industry substitutes are not confirmed without specific manufacturer validation.