TSM-106-01-L-DV-LC-007

$1.88

Description：CONN HEADER SMD 12POS 2.54MM
Series：TSM
Mfr：Samtec Inc.
Package：Tube,Tube

SKU:9a6416cef673 Category: Headers, Male Pins Brand: Samtec Inc.

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Product introduction

TSM-106-01-L-DV-LC-007 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Samtec Inc.. Its product description is CONN HEADER SMD 12POS 2.54MM. Review the specifications below when checking this part for your BOM.

Headers, Male Pins specifications for TSM-106-01-L-DV-LC-007

Description：CONN HEADER SMD 12POS 2.54MM
Series：TSM
Mfr：Samtec Inc.
Package：Tube,Tube
Connector Type：Header, Cuttable
Contact Type：Male Pin
Pitch - Mating：0.100" (2.54mm)
Number of Positions：12
Number of Rows：2
Row Spacing - Mating：0.100" (2.54mm)
Number of Positions Loaded：11
Style：Board to Board or Cable
Shrouding：Unshrouded
Mounting Type：Surface Mount
Termination：Solder
Fastening Type：Push-Pull
Contact Length - Mating：0.230" (5.84mm)
Contact Length - Post：-
Overall Contact Length：-
Insulation Height：0.100" (2.54mm)
Contact Shape：Square
Contact Finish - Mating：Gold
Contact Finish Thickness - Mating：10.0µin (0.25µm)
Contact Finish - Post：Tin
Contact Material：Phosphor Bronze
Insulation Material：Liquid Crystal Polymer (LCP)
Features：Board Lock
Operating Temperature：-55°C ~ 125°C
Ingress Protection：-
Material Flammability Rating：UL94 V-0
Insulation Color：Black
Current Rating (Amps)：-
Voltage Rating：-

Headers, Male Pins datasheet and documents for TSM-106-01-L-DV-LC-007

TSM-106-01-L-DV-LC-007

Headers, Male Pins Overview

The TSM-106-01-L-DV-LC-007 is a surface-mount header connector from Samtec's TSM series. It features a 2-row, 12-position configuration with a 0.100 inch (2.54mm) pitch. The contacts are tin-plated phosphor bronze pins designed for board-to-board or cable applications. Constructed with black liquid crystal polymer insulation rated UL94 V-0, it supports pick-and-place assembly and operates within a temperature range of -55°C to 125°C.

Headers, Male Pins Feature Summary

Supports automated pick-and-place manufacturing processes
Features push-pull locking mechanism for secure retention
Utilizes tin-plated contacts for reliable soldering

Headers, Male Pins Applications

Board-to-board interconnect systems
Cable-to-board connections
Flexible stacking solutions

Headers, Male Pins Procurement Notes

Verify the specific suffix 'LC' against official Samtec documentation to confirm contact plating specifications, as this variant typically denotes tin plating rather than gold. Ensure the ordering part number matches the required packaging format and pin count. Cross-reference the datasheet for precise mechanical dimensions and thermal ratings before finalizing procurement orders.

Headers, Male Pins Selection Notes

Select this component when tin-plated contacts are sufficient for the application environment and cost efficiency is prioritized over gold plating. It is suitable for standard surface-mount assembly lines requiring pick-and-place compatibility. Consider the operating temperature range and insulation material properties to ensure compliance with the target electronic system's environmental requirements.

Headers, Male Pins Part Context

This connector belongs to the TSM series, which provides flexible stacking solutions for high-density interconnects. The series offers various configurations to accommodate different board spacing and signal integrity needs. It is designed for modern electronics manufacturing where reliability and automated assembly are critical factors in the production workflow.