Headers, Male Pins TSM-109-01-S-DV-003 product image

TSM-109-01-S-DV-003

$3.32
  • Description:CONN HEADER SMD 18POS 2.54MM
  • Series:TSM
  • Mfr:Samtec Inc.
  • Package:Tube,Tube

SKU:dcfa004dffcc Category: Brand:

  
  • Quantity
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TSM-109-01-S-DV-003 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Samtec Inc.. Its product description is CONN HEADER SMD 18POS 2.54MM. Review the specifications below when checking this part for your BOM.

Headers, Male Pins specifications for TSM-109-01-S-DV-003

  • Description:CONN HEADER SMD 18POS 2.54MM
  • Series:TSM
  • Mfr:Samtec Inc.
  • Package:Tube,Tube
  • Connector Type:Header, Cuttable
  • Contact Type:Male Pin
  • Pitch - Mating:0.100" (2.54mm)
  • Number of Positions:18
  • Number of Rows:2
  • Row Spacing - Mating:0.100" (2.54mm)
  • Number of Positions Loaded:17
  • Style:Board to Board or Cable
  • Shrouding:Unshrouded
  • Mounting Type:Surface Mount
  • Termination:Solder
  • Fastening Type:Push-Pull
  • Contact Length - Mating:0.230" (5.84mm)
  • Contact Length - Post:-
  • Overall Contact Length:-
  • Insulation Height:0.100" (2.54mm)
  • Contact Shape:Square
  • Contact Finish - Mating:Gold
  • Contact Finish Thickness - Mating:30.0µin (0.76µm)
  • Contact Finish - Post:Tin
  • Contact Material:Phosphor Bronze
  • Insulation Material:Liquid Crystal Polymer (LCP)
  • Features:-
  • Operating Temperature:-55°C ~ 125°C
  • Ingress Protection:-
  • Material Flammability Rating:UL94 V-0
  • Insulation Color:Black
  • Current Rating (Amps):-
  • Voltage Rating:-

Headers, Male Pins datasheet and documents for TSM-109-01-S-DV-003

TSM-109-01-S-DV-003

Headers, Male Pins Overview

The Samtec TSM-109-01-S-DV-003 is a surface mount terminal strip featuring 18 positions arranged in two rows with a 2.54 mm pitch. It utilizes gold-plated phosphor bronze contacts and an LCP housing rated for -55°C to +125°C. The connector supports up to 495 VAC and offers a mating pin length of 5.84 mm, ensuring reliable board-to-board or cable interconnections.

Headers, Male Pins Feature Summary

  • Flexible stacking architecture enables variable height configurations
  • Gold-plated contacts provide enhanced corrosion resistance
  • LCP insulation ensures high thermal stability

Headers, Male Pins Applications

  • Board-to-board interconnects
  • Cable assemblies
  • High-density electronic modules

Headers, Male Pins Procurement Notes

Verify the specific suffix codes against official documentation to confirm exact plating thickness and termination style. Ensure compatibility with mating connectors regarding pin length and row alignment before finalizing procurement orders.

Headers, Male Pins Selection Notes

Select this component when flexible stacking heights are required alongside standard 2.54 mm spacing. Confirm that the operating temperature range and voltage ratings meet system requirements. Validate PCB footprint dimensions against design constraints.

Headers, Male Pins Part Context

This part belongs to the TSM series, designed for flexible stacking solutions. It provides a robust interconnect option for applications requiring customizable vertical spacing while maintaining a compact profile and reliable electrical performance.

Headers, Male Pins Replacement Considerations

Consult official substitution lists for compatible alternatives. Verify mechanical fit and electrical specifications before replacing.

TSM-109-01-S-DV-003TSM-109-01-S-DV-003
$3.32
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