TSM-111-04-H-SV

$2.72

Description：CONN HEADER SMD 11POS 2.54MM
Series：TSM
Mfr：Samtec Inc.
Package：Tube

SKU:1d08b6bb888a Category: Headers, Male Pins Brand: Samtec Inc.

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Product introduction

TSM-111-04-H-SV is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Samtec Inc.. Its product description is CONN HEADER SMD 11POS 2.54MM. Review the specifications below when checking this part for your BOM.

Headers, Male Pins specifications for TSM-111-04-H-SV

Description：CONN HEADER SMD 11POS 2.54MM
Series：TSM
Mfr：Samtec Inc.
Package：Tube
Connector Type：Header, Cuttable
Contact Type：Male Pin
Pitch - Mating：0.100" (2.54mm)
Number of Positions：11
Number of Rows：1
Row Spacing - Mating：-
Number of Positions Loaded：All
Style：Board to Board or Cable
Shrouding：Unshrouded
Mounting Type：Surface Mount
Termination：Solder
Fastening Type：Push-Pull
Contact Length - Mating：0.120" (3.05mm)
Contact Length - Post：-
Overall Contact Length：-
Insulation Height：0.100" (2.54mm)
Contact Shape：Square
Contact Finish - Mating：Gold
Contact Finish Thickness - Mating：30.0µin (0.76µm)
Contact Finish - Post：Gold
Contact Material：Phosphor Bronze
Insulation Material：Liquid Crystal Polymer (LCP)
Features：-
Operating Temperature：-55°C ~ 125°C
Ingress Protection：-
Material Flammability Rating：UL94 V-0
Insulation Color：Black
Current Rating (Amps)：-
Voltage Rating：-

Headers, Male Pins datasheet and documents for TSM-111-04-H-SV

TSM-111-04-H-SV

Headers, Male Pins Overview

The TSM-111-04-H-SV is a board connector manufactured by Samtec Inc. It features 11 contacts arranged in a single row of male pins with a straight orientation and surface mount terminals. The connector body measures 0.1 inch in width, 0.15 inch in depth, and 1.1 inch in length. Contact mating surfaces utilize gold flash over nickel plating, while termination finishes are matte tin. The unit includes PEG board mounting options and has a black insulator.

Headers, Male Pins Feature Summary

Straight surface mount terminal configuration for direct PCB integration
Male pin contact gender designed for header applications
Gold flash over nickel contact mating finish for reliable conductivity
Matte tin termination finish compatible with standard soldering processes

Headers, Male Pins Applications

Board-to-board interconnection systems
Surface mount electronic assemblies
High-density circuit board stacking

Headers, Male Pins Procurement Notes

Verify the specific part number against official Samtec documentation to confirm compliance with RoHS standards and reachability requirements. Ensure that the ordering suffixes match the required contact plating and termination specifications. Cross-reference the manufacturer's datasheet for accurate mechanical dimensions and thermal operating ranges before finalizing procurement orders.

Headers, Male Pins Selection Notes

Select this component based on the requirement for a 11-position single-row male header with surface mount capabilities. Consider the 0.100-inch pitch and straight profile for appropriate board layout spacing. Evaluate the gold flash over nickel mating finish for durability needs and matte tin termination for soldering compatibility within the target assembly environment.

Headers, Male Pins Part Context

This component belongs to the TSM series of flexible stacking solutions from Samtec. These connectors are engineered for high-density applications requiring reliable electrical connections in compact spaces. The series supports various configurations including different contact counts and mounting styles to accommodate diverse design constraints.