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TSM-113-01-TM-DV-LC-P is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Samtec Inc.. Its product description is CONN HEADER SMD 26POS 2.54MM. Review the specifications below when checking this part for your BOM.
Headers, Male Pins specifications for TSM-113-01-TM-DV-LC-P
- Description：CONN HEADER SMD 26POS 2.54MM
- Series：TSM
- Mfr：Samtec Inc.
- Package：Tube
- Connector Type：Header, Cuttable
- Contact Type：Male Pin
- Pitch - Mating：0.100" (2.54mm)
- Number of Positions：26
- Number of Rows：2
- Row Spacing - Mating：0.100" (2.54mm)
- Number of Positions Loaded：All
- Style：Board to Board or Cable
- Shrouding：Unshrouded
- Mounting Type：Surface Mount
- Termination：Solder
- Fastening Type：Push-Pull
- Contact Length - Mating：0.230" (5.84mm)
- Contact Length - Post：-
- Overall Contact Length：-
- Insulation Height：0.100" (2.54mm)
- Contact Shape：Square
- Contact Finish - Mating：Tin
- Contact Finish Thickness - Mating：-
- Contact Finish - Post：Tin
- Contact Material：Phosphor Bronze
- Insulation Material：Liquid Crystal Polymer (LCP)
- Features：Board Lock, Pick and Place
- Operating Temperature：-55°C ~ 105°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：-
- Voltage Rating：-
Headers, Male Pins datasheet and documents for TSM-113-01-TM-DV-LC-P
Headers, Male Pins Overview
The TSM-113-01-TM-DV-LC-P is a surface mount board connector from Samtec, featuring 26 contacts arranged in two rows. It utilizes a 0.100 inch (2.54 mm) pitch with .025 inch square pin terminals. The connector is designed for vertical installation and includes pick-and-place pads to facilitate automated assembly. Contact plating is matte tin, and the insulator is constructed from liquid crystal polymer.
Headers, Male Pins Feature Summary
- Surface mount design with integrated pick-and-place pads for automated manufacturing
- Dual row configuration with .025 inch square pin terminals
- Matte tin contact plating on phosphor bronze base material
Headers, Male Pins Applications
- Board-to-board interconnections requiring surface mount technology
- Automated PCB assembly processes utilizing pick-and-place equipment
- General purpose electronic circuitry connections
Headers, Male Pins Procurement Notes
Verify the specific suffix codes against official documentation to confirm terminal style, plating specification, and tape & reel packaging requirements. Ensure the selected variant matches the required contact count and orientation for the target application.
Headers, Male Pins Selection Notes
Select this component when surface mount mounting is required alongside automated placement capabilities. The dual row layout supports higher density connections compared to single row options. Verify compatibility with mating socket heights and PCB stack-up constraints.
Headers, Male Pins Part Context
This part belongs to the TSM series of .100 inch surface mount headers. The series offers various row configurations and terminal styles to accommodate different board space and electrical requirements within Samtec's connector portfolio.
Headers, Male Pins Replacement Considerations
Compatible substitutes include other TSM series variants with matching pitch and contact count. Verify that alternative parts support identical surface mount termination and pick-and-place pad configurations.
Explore related parts through Rectangular Connectors, Connectors, Interconnects, all product categories, ChipApex homepage.
