TSM-117-02-L-DV-A-P

Headers, Male Pins Overview

The TSM-117-02-L-DV-A-P is a surface mount terminal strip from the Samtec TSM series. It features a dual-row configuration with 34 positions and a 0.100-inch (2.54 mm) pitch. The connector utilizes phosphor bronze contacts with gold plating on the mating interface and tin plating on the tail. Designed for board-to-board or cable applications, it operates within a temperature range of -55°C to +105°C. The housing is constructed from black liquid crystal polymer (LCP) rated UL94 V-0.

Headers, Male Pins Feature Summary

• Surface mount design optimized for automated PCB assembly processes
• Dual-row header configuration providing high density interconnect capability
• Gold-plated mating contacts ensure reliable signal transmission and corrosion resistance
• Flexible stacking solution architecture allows for varied height configurations

Headers, Male Pins Applications

• Board-to-board interconnections in compact electronic assemblies
• Cable-to-board connections requiring surface mount termination
• High-density circuit boards where vertical space is constrained
• Industrial control modules utilizing standard 2.54mm pitch interfaces

Headers, Male Pins Procurement Notes

Verify the specific suffix 'P' against the manufacturer's current catalog to confirm packaging details and availability status. Ensure the selected variant matches the required contact length and plating specifications for the target application environment. Cross-reference the part number with official distributor databases to confirm RoHS compliance and lead times prior to ordering.

Headers, Male Pins Selection Notes

Select this component when a dual-row surface mount header with 2.54mm pitch is required for rigid board connections. The gold-plated phosphor bronze contacts are suitable for low-to-medium current applications. Consider the operating temperature range and insulation material properties to ensure compatibility with the soldering profile and environmental conditions of the final assembly.

Headers, Male Pins Part Context

This part belongs to the TSM series of flexible stacking solutions by Samtec. These headers are designed to provide reliable interconnects in space-constrained environments. The series offers various row options and contact lengths to accommodate different board thicknesses and mating requirements while maintaining a consistent 0.100-inch pitch.

Headers, Male Pins Replacement Considerations

Compatible substitutes include other Samtec TSM series headers with matching 34-position dual-row configurations and 2.54mm pitch. Verify that alternative parts maintain the same surface mount footprint and contact plating specifications to ensure mechanical and electrical compatibility without redesigning the PCB layout.