TSM-125-04-S-DV

Headers, Male Pins Overview

The TSM-125-04-S-DV is a dual-row male header connector manufactured by Samtec Inc. It features a 0.100 inch (2.54 mm) pitch and provides 50 contacts arranged in two rows of 25 positions each. Designed for surface mount applications, the component utilizes .025 inch square terminal strips with gold plating over nickel on the mating interface and matte tin termination. The housing is constructed from black insulator material, ensuring reliable board-to-board or cable connections in high-density electronic assemblies.

Headers, Male Pins Feature Summary

• Surface mount design optimized for automated assembly processes
• Gold-plated mating interface ensures low contact resistance and corrosion resistance
• Square pin terminal geometry provides secure mechanical retention

Headers, Male Pins Applications

• High-density board-to-board interconnections
• Cable-to-board attachment systems
• Industrial control module interfaces

Headers, Male Pins Procurement Notes

Verify that the specific part number matches the required dual-row configuration and surface mount footprint before ordering. Confirm that the gold plating specification aligns with environmental requirements. Ensure compatibility with standard reflow soldering profiles to maintain connection integrity during assembly. Cross-reference the pin count and pitch against the target PCB layout to prevent installation errors.

Headers, Male Pins Selection Notes

Select this component when a dual-row surface mount header with a 0.100 inch pitch is required. The gold-plated contacts are suitable for environments demanding high reliability and corrosion resistance. Consider the physical dimensions and mounting orientation to ensure adequate clearance within the enclosure. Evaluate the thermal performance during soldering to protect adjacent components.

Headers, Male Pins Part Context

This connector belongs to the TSM series of .100 inch surface mount terminal strips. The series offers various row configurations and termination options to support diverse electronic packaging needs. The dual-row variant provides increased I/O density in a compact footprint compared to single-row alternatives.

Headers, Male Pins Replacement Considerations

Compatible substitutes include TSM-125-04-S-DV-LC and TSM-125-04-SS-DV. Verify that alternative parts maintain the same 0.100 inch pitch and 50-contact configuration. Ensure mechanical compatibility with existing PCB footprints and mating connectors.