TSM-135-01-S-DV

Headers, Male Pins Overview

Samtec TSM-135-01-S-DV is a surface mount header connector featuring a 2.54 mm pitch and 70 positions across two rows. It utilizes phosphor bronze contacts with gold plating for reliable signal transmission. The housing is constructed from black liquid crystal polymer (LCP) rated UL 94 V-0. Designed for board-to-board or cable applications, it operates within a temperature range of -55°C to +125°C.

Headers, Male Pins Feature Summary

• Flexible stacking solution design accommodates misalignment during mating
• Surface mount termination ensures secure PCB attachment
• Gold-plated phosphor bronze contacts provide corrosion resistance

Headers, Male Pins Applications

• Board-to-board interconnects
• Cable assemblies
• High-density electronic modules

Headers, Male Pins Procurement Notes

Verify the specific part number against official Samtec documentation to confirm pin count and configuration. Ensure compatibility with mating connectors regarding height and contact length. Check RoHS compliance status and moisture sensitivity levels before procurement. Confirm surface mount footprint requirements match your PCB design specifications.

Headers, Male Pins Selection Notes

Select this component for applications requiring flexible stacking capabilities and high reliability. Consider the 2.54 mm pitch for standard spacing needs. Evaluate thermal performance within the specified operating temperature range. Verify that the surface mount package aligns with automated assembly processes.

Headers, Male Pins Part Context

The TSM series represents Samtec's flexible stacking solutions, designed for high-reliability interconnects. This model belongs to the TSM family, characterized by its ability to handle slight misalignments. It serves as a critical component in modern electronics where space efficiency and connection integrity are paramount.

Headers, Male Pins Replacement Considerations

No public confirmed substitute part numbers are available.