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TSM104WAIN is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is IC OPAMP GP 4 CIRCUIT 16DIP. Review the specifications below when checking this part for your BOM.
The TSM104WAIN is a monolithic integrated circuit from STMicroelectronics featuring four operational amplifiers and an adjustable shunt voltage reference. It operates within an industrial temperature range of -40°C to +105°C and supports a wide power supply range of ±1.5V to ±15V (3V to 30V single supply). Key electrical parameters include a gain-bandwidth product of 900 kHz, a slew rate of 300 mV/µs, and a typical input offset voltage of 0.5mV. The device draws low supply current of 375µA per op-amp at 5V and provides 2kV ESD protection. It is housed in a 16-pin SOIC package.
Verify the specific suffix 'AIN' against the official STMicroelectronics datasheet to confirm the exact temperature grade and packaging variant. Ensure the selected component matches the required industrial operating range and pinout configuration for your design. Cross-reference the ordering code with authorized distributors to confirm availability and authenticity before procurement.
Select this component when a combined solution for signal conditioning and voltage referencing is required. It is suitable for applications needing low power consumption and moderate speed. Consider the SOIC-16 package constraints and the need for adjustable reference precision. Evaluate if the 900kHz bandwidth meets the system's dynamic requirements.
The TSM104W series belongs to STMicroelectronics' portfolio of mixed-signal analog ICs designed for industrial applications. It complements other devices like the TSM103W, which offers a fixed voltage reference. This family targets designs requiring integration of multiple functions to reduce board space and simplify power distribution in complex electronic systems.
Check for direct pin-to-pin replacements within the TSM104W family, such as variants with different reference precisions or temperature grades. Verify compatibility with existing PCB layouts and thermal management strategies when substituting.
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