TSPC603RVGH10LC

TSPC603RVGH10LC

$320.05
  • Description:IC MPU 603E 233MHZ 255CBGA
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tray

SKU:6eefce02b0cc Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MPU 603E 233MHZ 255CBGA
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tray
  • Core Processor:PowerPC 603e
  • Number of Cores/Bus Width:1 Core, 32-Bit
  • Speed:233MHz
  • Co-Processors/DSP:-
  • RAM Controllers:-
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:-
  • SATA:-
  • USB:-
  • Voltage - I/O:3.3V
  • Operating Temperature:-40°C ~ 110°C (TC)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:255-BCBGA Exposed Pad
  • Supplier Device Package:255-HiTCE-CBGA (21x21)
  • Additional Interfaces:-
  • Grade:-
  • Qualification:-

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TSPC603RVGH10LC

Overview

The TSPC603RVGH10LC is a PowerPC 603e RISC microprocessor manufactured by Microchip Technology. It features a 32-bit architecture with a maximum internal clock frequency of 300 MHz and a selectable bus clock up to 75 MHz. The device utilizes a HiTCE CBGA 255 package with 255 terminals, operating within a temperature range of -55°C to +125°C. Core supply voltage is 2.5V ±5%, while I/O voltage is 3.3V ±5%. It includes dual 16 KB caches, an integrated FPU, and supports JTAG boundary scan.

Feature Summary

  • Superscalar execution capability issuing up to three instructions per clock cycle
  • Integrated on-chip instruction and data Memory Management Units (MMUs)
  • Software-controllable power-saving modes including Nap, Doze, and Sleep
  • Pipelined floating-point unit compliant with IEEE 754 standard

Applications

  • High-reliability embedded processing systems
  • Military and aerospace avionics applications
  • Industrial control environments requiring extended temperature ranges

Procurement Notes

Verify the specific suffix 'H' confirms the HiTCE CBGA 255 package type and lead finish compliance. Confirm that the ordering code matches the required MIL-STD-883 Class B screening level. Ensure the voltage specifications align with the system's 2.5V core and 3.3V I/O requirements before finalizing procurement.

Selection Notes

Select this component for designs requiring high-performance RISC processing in harsh environments. The HiTCE package offers robust thermal dissipation suitable for high-frequency operation. Consider the available power management modes if energy efficiency during idle states is a critical design constraint.

Part Context

This part belongs to the PowerPC 603R family, which is a low-power implementation of the PowerPC 603e architecture. It maintains pin-to-pin compatibility with the 603e and 603P in Cerquad packages but is offered in various ceramic BGA formats for enhanced performance and reliability in demanding applications.

Replacement Considerations

Direct replacements include other variants within the TSPC603R family such as TSPC603RVGSU14LC or TSXPC603RMGB/T10LC, provided the package type and speed grade match the design requirements.

TSPC603RVGH10LCTSPC603RVGH10LC
$320.05
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