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The TSPC603RVGH10LC is a PowerPC 603e RISC microprocessor manufactured by Microchip Technology. It features a 32-bit architecture with a maximum internal clock frequency of 300 MHz and a selectable bus clock up to 75 MHz. The device utilizes a HiTCE CBGA 255 package with 255 terminals, operating within a temperature range of -55°C to +125°C. Core supply voltage is 2.5V ±5%, while I/O voltage is 3.3V ±5%. It includes dual 16 KB caches, an integrated FPU, and supports JTAG boundary scan.
Verify the specific suffix 'H' confirms the HiTCE CBGA 255 package type and lead finish compliance. Confirm that the ordering code matches the required MIL-STD-883 Class B screening level. Ensure the voltage specifications align with the system's 2.5V core and 3.3V I/O requirements before finalizing procurement.
Select this component for designs requiring high-performance RISC processing in harsh environments. The HiTCE package offers robust thermal dissipation suitable for high-frequency operation. Consider the available power management modes if energy efficiency during idle states is a critical design constraint.
This part belongs to the PowerPC 603R family, which is a low-power implementation of the PowerPC 603e architecture. It maintains pin-to-pin compatibility with the 603e and 603P in Cerquad packages but is offered in various ceramic BGA formats for enhanced performance and reliability in demanding applications.
Direct replacements include other variants within the TSPC603R family such as TSPC603RVGSU14LC or TSXPC603RMGB/T10LC, provided the package type and speed grade match the design requirements.