TSPC603RVGH8LC

TSPC603RVGH8LC

$262.34
  • Description:IC MPU 603E 200MHZ 255CBGA
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tray

SKU:cd3347ba4c48 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MPU 603E 200MHZ 255CBGA
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tray
  • Core Processor:PowerPC 603e
  • Number of Cores/Bus Width:1 Core, 32-Bit
  • Speed:200MHz
  • Co-Processors/DSP:-
  • RAM Controllers:-
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:-
  • SATA:-
  • USB:-
  • Voltage - I/O:3.3V
  • Operating Temperature:-40°C ~ 110°C (TC)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:255-BCBGA Exposed Pad
  • Supplier Device Package:255-HiTCE-CBGA (21x21)
  • Additional Interfaces:-
  • Grade:-
  • Qualification:-

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TSPC603RVGH8LC

Overview

The TSPC603RVGH8LC is a PowerPC 603e RISC microprocessor manufactured by Microchip Technology. It features a superscalar architecture capable of issuing three instructions per clock cycle and integrates dual 16 KB caches with on-chip MMUs. The device supports selectable 32-bit or 64-bit data buses, a 32-bit address bus, and an IEEE 754 compatible floating-point unit. Operating at frequencies up to 300 MHz with a maximum bus clock of 75 MHz, it utilizes a CBGA 255 package. The processor operates within a core voltage range of 2.375V to 2.625V and an I/O voltage range of 3.135V to 3.465V.

Feature Summary

  • Superscalar execution pipeline supporting up to three instructions per clock cycle
  • Integrated dual 16 KB physically addressed caches with Memory Management Units
  • Software-controllable power-saving modes including nap, doze, and sleep states
  • On-chip debug support compliant with IEEE P 1149-1 JTAG boundary-scan standards

Applications

  • High-performance embedded processing systems requiring low power consumption
  • Industrial control applications operating in full military temperature ranges
  • Avionics and aerospace subsystems utilizing MIL-PRF-38535 Class Q screening
  • Automotive electronics platforms demanding robust thermal management

Procurement Notes

Verify the specific ordering suffix GH8LC against official Microchip documentation to confirm package type and screening level. Ensure compliance with MIL-STD-883 Class B requirements if applicable. Confirm lead material specifications and RoHS status prior to integration. Validate that the procurement source provides traceability for high-reliability ceramic packages.

Selection Notes

Select this component for designs requiring a 32-bit RISC architecture with integrated memory management and floating-point capabilities. Consider the CBGA 255 package constraints regarding thermal dissipation and board space. Evaluate system power budgets against the specified typical power dissipation values at target clock frequencies. Ensure compatibility with existing TTL interface protocols and arbitration logic.

Part Context

This microprocessor belongs to the PowerPC 603R family, representing a low-power implementation of the PowerPC architecture. It maintains pin-to-pin compatibility with the PowerPC 603e and 603P in Cerquad packages. The device is manufactured using advanced CMOS process technology designed for reduced power consumption while maintaining high throughput through superscalar execution capabilities.

Replacement Considerations

Direct substitutes include TSXPC603RMGB/T10LC and TSPC603RMGU12LC. Verify functional equivalence and package compatibility before substitution.

TSPC603RVGH8LCTSPC603RVGH8LC
$262.34
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