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The TSPC603RVGS10LC is a PowerPC 603e RISC microprocessor manufactured by Microchip Technology. It features a superscalar architecture capable of issuing three instructions per clock cycle and integrates dual 16 KB caches with on-chip MMUs. The device operates at a maximum internal frequency of 300 MHz and a bus frequency of 75 MHz, utilizing a 2.5V core and 3.3V I/O supply. It is housed in a CBGA 255 package with a 21 mm x 21 mm footprint.
Verify the specific suffix 'G' indicates the CBGA 255 ceramic package configuration. Confirm compliance with MIL-STD-883 Class B screening requirements if military qualification is necessary. Ensure the ordering code matches the required thermal and electrical specifications for the target application environment.
Select this component for designs requiring high instruction throughput and low-power operation within the PowerPC ecosystem. Consider the 300 MHz peak performance and integrated floating-point unit for complex mathematical tasks. Evaluate the CBGA 255 package for its superior thermal dissipation characteristics compared to leaded alternatives.
This processor belongs to the PowerPC 603R family, representing a low-power implementation of the PowerPC architecture. It maintains pin-to-pin compatibility with the PowerPC 603e and 603P in Cerquad packages while offering enhanced performance through superscalar execution and advanced power management features.
TSPC603RMGH12LC
The device supports four programmable power states: Full Power, Doze, Nap, and Sleep, allowing for progressive reduction of power consumption based on system activity.
Yes, it includes on-chip Instruction and Data Memory Management Units (MMUs) with 64-entry Translation Lookaside Buffers to support demand-paged virtual memory address translation.