TSPC603RVGS10LC

TSPC603RVGS10LC

$324.35
  • Description:IC MPU 603E 233MHZ 255CICBGA
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tray

SKU:610fb71264c6 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MPU 603E 233MHZ 255CICBGA
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tray
  • Core Processor:PowerPC 603e
  • Number of Cores/Bus Width:1 Core, 32-Bit
  • Speed:233MHz
  • Co-Processors/DSP:-
  • RAM Controllers:-
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:-
  • SATA:-
  • USB:-
  • Voltage - I/O:3.3V
  • Operating Temperature:-40°C ~ 110°C (TC)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:255-BCBGA Exposed Pad
  • Supplier Device Package:255-CI-CBGA (21x21)
  • Additional Interfaces:-
  • Grade:-
  • Qualification:-

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TSPC603RVGS10LC

Overview

The TSPC603RVGS10LC is a PowerPC 603e RISC microprocessor manufactured by Microchip Technology. It features a superscalar architecture capable of issuing three instructions per clock cycle and integrates dual 16 KB caches with on-chip MMUs. The device operates at a maximum internal frequency of 300 MHz and a bus frequency of 75 MHz, utilizing a 2.5V core and 3.3V I/O supply. It is housed in a CBGA 255 package with a 21 mm x 21 mm footprint.

Feature Summary

  • Superscalar execution pipeline supporting up to three instructions per clock
  • Integrated dual 16 KB physically addressed caches for instructions and data
  • On-chip Memory Management Units (MMUs) with Translation Lookaside Buffers
  • Programmable power management modes including Nap, Doze, and Sleep

Applications

  • High-performance embedded processing systems
  • Industrial control applications requiring extended temperature ranges
  • Military-grade avionics and defense electronics
  • Automotive electronic subsystems

Procurement Notes

Verify the specific suffix 'G' indicates the CBGA 255 ceramic package configuration. Confirm compliance with MIL-STD-883 Class B screening requirements if military qualification is necessary. Ensure the ordering code matches the required thermal and electrical specifications for the target application environment.

Selection Notes

Select this component for designs requiring high instruction throughput and low-power operation within the PowerPC ecosystem. Consider the 300 MHz peak performance and integrated floating-point unit for complex mathematical tasks. Evaluate the CBGA 255 package for its superior thermal dissipation characteristics compared to leaded alternatives.

Part Context

This processor belongs to the PowerPC 603R family, representing a low-power implementation of the PowerPC architecture. It maintains pin-to-pin compatibility with the PowerPC 603e and 603P in Cerquad packages while offering enhanced performance through superscalar execution and advanced power management features.

Replacement Considerations

TSPC603RMGH12LC

FAQ

What are the supported power saving modes?

The device supports four programmable power states: Full Power, Doze, Nap, and Sleep, allowing for progressive reduction of power consumption based on system activity.

Does the processor support virtual memory?

Yes, it includes on-chip Instruction and Data Memory Management Units (MMUs) with 64-entry Translation Lookaside Buffers to support demand-paged virtual memory address translation.

TSPC603RVGS10LCTSPC603RVGS10LC
$324.35
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