TSPC603RVGS12LC

TSPC603RVGS12LC

$411.93
  • Description:IC MPU 603E 266MHZ 255CICBGA
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tray

SKU:3541ae9bd966 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MPU 603E 266MHZ 255CICBGA
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tray
  • Core Processor:PowerPC 603e
  • Number of Cores/Bus Width:1 Core, 32-Bit
  • Speed:266MHz
  • Co-Processors/DSP:-
  • RAM Controllers:-
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:-
  • SATA:-
  • USB:-
  • Voltage - I/O:3.3V
  • Operating Temperature:-40°C ~ 110°C (TC)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:255-BCGA
  • Supplier Device Package:255-CI-CGA (21x21)
  • Additional Interfaces:-
  • Grade:-
  • Qualification:-

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TSPC603RVGS12LC

Overview

The TSPC603RVGS12LC is a PowerPC 603R RISC microprocessor manufactured by Microchip Technology. It features a superscalar architecture capable of issuing up to three instructions per clock cycle and integrates dual 16 KB caches with on-chip MMUs. The device supports selectable bus clocks, operating at a maximum internal frequency of 300 MHz and a bus frequency of 75 MHz. It utilizes a CI-CGA 255 package with 255 terminals and operates within a temperature range of -55°C to +125°C.

Feature Summary

  • Superscalar execution pipeline supporting up to three instructions per clock
  • Integrated dual 16 KB physically addressed caches with Memory Management Units
  • Software-controllable power-saving modes including Nap, Doze, and Sleep
  • On-chip debug support compliant with IEEE P 1149.1 JTAG standards

Applications

  • High-performance embedded processing systems requiring low power consumption
  • Industrial control applications operating in full military temperature ranges
  • Avionics and defense electronics utilizing MIL-PRF-38535 Class Q components
  • Systems requiring hardware-level virtual memory address translation

Procurement Notes

Verify the specific ordering suffix against manufacturer documentation to confirm package type and screening level. Confirm compliance requirements such as MIL-STD-883 or MIL-PRF-38535 Class Q if applicable to your system design. Ensure voltage supply specifications match the recommended operating conditions for VDD, AVDD, and OVDD prior to integration.

Selection Notes

Select this component for designs requiring a 32-bit PowerPC implementation with integrated floating-point capabilities. Consider the CI-CGA 255 package constraints regarding thermal management and board space. Evaluate the need for specific power management modes based on system duty cycles and performance requirements.

Part Context

This part belongs to the PowerPC 603R family, which is a low-power implementation of the PowerPC architecture. It maintains pin-to-pin compatibility with the PowerPC 603e and 603P in Cerquad packages. The 603R is designed for high efficiency using advanced CMOS process technology while maintaining interface compatibility with TTL devices.

Replacement Considerations

The TSPC603RVGS12LC is functionally compatible with the TSPC603RVGSU14LC and TSXPC603RMGB/T10LC within the PowerPC 603R family. Verify package dimensions and pinout configurations when substituting between CBGA, CI-CGA, and HiTCE variants.

TSPC603RVGS12LCTSPC603RVGS12LC
$411.93
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