TSPC603RVGS6LC

TSPC603RVGS6LC

$253.59
  • Description:IC MPU 603E 166MHZ 255CICBGA
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tray

SKU:827f9ec2adbb Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MPU 603E 166MHZ 255CICBGA
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tray
  • Core Processor:PowerPC 603e
  • Number of Cores/Bus Width:1 Core, 32-Bit
  • Speed:166MHz
  • Co-Processors/DSP:-
  • RAM Controllers:-
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:-
  • SATA:-
  • USB:-
  • Voltage - I/O:3.3V
  • Operating Temperature:-40°C ~ 110°C (TC)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:255-BCBGA Exposed Pad
  • Supplier Device Package:255-CI-CBGA (21x21)
  • Additional Interfaces:-
  • Grade:-
  • Qualification:-

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TSPC603RVGS6LC

Overview

The TSPC603RVGS6LC is a PowerPC 603R RISC microprocessor manufactured by Microchip Technology. It features a superscalar architecture capable of issuing three instructions per clock cycle and integrates dual 16 KB caches with on-chip MMUs. The device operates at a maximum internal frequency of 300 MHz with a selectable bus clock up to 75 MHz. It supports a 32-bit address bus and a configurable 32- or 64-bit data bus. The component utilizes a CBGA 255 package, complies with MIL-STD-883 Class B screening, and functions within a core voltage range of 2.375 V to 2.625 V.

Feature Summary

  • Superscalar execution pipeline supporting up to three instructions per clock cycle
  • Integrated dual 16 KB physically addressed caches with Memory Management Units
  • Software-controllable power-saving modes including nap, doze, and sleep states
  • On-chip debug support via JTAG boundary-scan capabilities

Applications

  • High-performance embedded processing systems requiring low power consumption
  • Industrial control applications operating in extended temperature ranges
  • Aerospace and defense electronics utilizing military-grade screened components
  • Systems requiring IEEE 754 compatible floating-point arithmetic operations

Procurement Notes

Verify the specific ordering suffix against official datasheets to confirm package type and screening level. Confirm compliance requirements such as MIL-STD-883 Class B if applicable. Ensure thermal management solutions align with the specified junction-to-case resistance values for the CBGA 255 package. Validate that system voltage supplies match the recommended operating conditions for core and I/O rails.

Selection Notes

Select this component for designs necessitating a 32-bit RISC architecture with integrated cache and MMU capabilities. Consider the CBGA 255 package for high-density interconnect requirements. Evaluate thermal dissipation needs based on the estimated power consumption at target clock frequencies. Ensure software development tools support the PowerPC 603R instruction set and debugging interfaces.

Part Context

This microprocessor belongs to the PowerPC 603 family, representing a low-power implementation of the Reduced Instruction Set Computer architecture. It maintains pin-to-pin compatibility with earlier versions like the 603e in certain packages while offering enhanced performance through superscalar execution. The device is designed for applications demanding efficient processing within constrained power envelopes.

Replacement Considerations

The TSPC603RVGS6LC is functionally equivalent to the TSXPC603RVGB/T8LC regarding core specifications. Verify package compatibility and screening levels when substituting between variants within the PowerPC 603R product line.

TSPC603RVGS6LCTSPC603RVGS6LC
$253.59
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