TSPC603RVGS8LC

TSPC603RVGS8LC

$265.86
  • Description:IC MPU 603E 200MHZ 255CICBGA
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tray

SKU:1078355539df Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MPU 603E 200MHZ 255CICBGA
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tray
  • Core Processor:PowerPC 603e
  • Number of Cores/Bus Width:1 Core, 32-Bit
  • Speed:200MHz
  • Co-Processors/DSP:-
  • RAM Controllers:-
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:-
  • SATA:-
  • USB:-
  • Voltage - I/O:3.3V
  • Operating Temperature:-40°C ~ 110°C (TC)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:255-BCBGA Exposed Pad
  • Supplier Device Package:255-CI-CBGA (21x21)
  • Additional Interfaces:-
  • Grade:-
  • Qualification:-

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TSPC603RVGS8LC

Overview

The TSPC603RVGS8LC is a RISC microprocessor based on the PowerPC 603R architecture, manufactured by Microchip Technology. It features a superscalar design capable of issuing three instructions per clock cycle and integrates dual 16 KB caches with on-chip MMUs. The device supports selectable bus clocks up to 75 MHz and an internal frequency up to 300 MHz. It utilizes a CBGA 255 package with a 32-bit address bus and a 64-bit data bus option. Operating conditions include core voltages of 2.5V or 3.3V and temperature ranges extending from -55°C to +125°C.

Feature Summary

  • Superscalar execution pipeline supporting up to three instructions per clock
  • Integrated dual 16 KB physically addressed caches for instructions and data
  • On-chip Memory Management Units with Translation Lookaside Buffers
  • Programmable power-saving modes including Nap, Doze, and Sleep

Applications

  • High-performance embedded processing systems
  • Industrial control applications requiring wide temperature operation
  • Military-grade electronic equipment
  • Network infrastructure components

Procurement Notes

Verify that the specific suffix GS8LC corresponds to the CI-CGA 255 package variant as defined in official documentation. Confirm compliance with MIL-PRF-38535 Class Q or B screening requirements if specified for your application. Ensure voltage levels match the 2.5V or 3.3V core supply specifications. Validate thermal management strategies for the ceramic ball grid array package under maximum load conditions.

Selection Notes

Select this component when a low-power PowerPC implementation with superscalar capabilities is required. Consider the CBGA 255 package for high-density board layouts. Evaluate the need for 64-bit data bus width versus 32-bit options based on system memory architecture. Ensure the design accommodates the specific voltage tolerances for VDD, AVDD, and OVDD supplies.

Part Context

This processor belongs to the PowerPC 603e family, specifically the 603R low-power implementation. It maintains pin-to-pin compatibility with the 603e and 603P in Cerquad packages. The device represents an evolution in reduced instruction set computing within the PowerPC ecosystem, focusing on efficiency and performance balance for embedded environments.

Replacement Considerations

The PowerPC 603e and 603P are pin-compatible alternatives in Cerquad packages. Verify package type differences between CBGA and Cerquad variants before substitution. Check datasheet revisions for any functional updates between 603R and predecessor models.

TSPC603RVGS8LCTSPC603RVGS8LC
$265.86
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