TSPC603RVGU12LC

Overview

The TSPC603RVGU12LC is a RISC microprocessor based on the PowerPC 603e architecture, manufactured by Microchip Technology. It features a superscalar design capable of issuing up to three instructions per clock cycle and integrates dual 16 KB caches for instructions and data. The device supports a selectable 32-bit or 64-bit data bus with a 32-bit address bus, providing a 4-Gbyte direct addressing range. It includes an on-chip floating-point unit compliant with IEEE 754 standards and offers four software-controllable power-saving modes: nap, doze, sleep, and full power with dynamic management. The processor operates at a maximum internal frequency of 300 MHz and a bus frequency of 75 MHz.

Feature Summary

• Superscalar execution pipeline supporting up to three instructions per clock cycle
• Integrated dual 16 KB physically addressed caches with Memory Management Units
• IEEE 754 compatible pipelined floating-point unit for single and double precision operations
• Four programmable power management modes including nap, doze, and sleep

Applications

• High-performance embedded systems requiring low-power operation
• Industrial control applications utilizing MIL-STD-883 screening
• Aerospace and defense electronics demanding extended temperature ranges
• Systems requiring JTAG boundary-scan testability and on-chip debugging

Procurement Notes

Verify that the specific ordering suffix matches the required package type, as the G suffix denotes CBGA 255. Confirm compliance with MIL-PRF-38535 Class Q or Atmel standards if military-grade reliability is required. Ensure voltage levels align with the recommended operating conditions for VDD, AVDD, and OVDD. Check for lead-free status requirements against RoHS regulations, as this component may not be fully compliant depending on the manufacturing lot.

Selection Notes

Select this component when a PowerPC 603e compatible core is needed with enhanced thermal performance in ceramic packages. Consider the CI-CGA 255 package for applications requiring solder column interposers. Evaluate the 300 MHz processing speed against system latency requirements. Verify that the external arbiter protocol supports the necessary multi-master bus configurations for the target application architecture.

Part Context

This part belongs to the PowerPC 603R family, which serves as a low-power implementation of the PowerPC microprocessor family. It maintains pin-to-pin compatibility with the PowerPC 603e and 603P in Cerquad packages. The 603R utilizes advanced CMOS process technology to reduce power consumption while maintaining high throughput through superscalar execution capabilities.

Replacement Considerations

Public confirmed substitute part numbers include TSXPC603RMGB/T10LC and TSPC603EVGB/T2ML.