TSW-135-25-T-S-RA

Headers, Male Pins Overview

TSW-135-25-T-S-RA is a single-row, right-angle PCB header from the Samtec TSW series. It features 35 contacts with a 2.54 mm (0.100 inch) pitch. The connector utilizes tin-plated phosphor bronze terminals and a black polybutylene terephthalate (PBT) insulator. Designed for through-hole mounting, it supports board-to-board or cable applications within an operating temperature range of -55°C to +105°C.

Headers, Male Pins Feature Summary

• Right-angle configuration facilitates compact vertical board stacking.
• Standard strip design allows for custom length cutting.
• Tin-plated terminals provide reliable soldering performance.

Headers, Male Pins Applications

• Board-to-board interconnections
• Cable-to-board connections
• General-purpose electronic assemblies

Headers, Male Pins Procurement Notes

Verify the specific contact count and terminal plating against official datasheets before procurement. Confirm that the right-angle orientation matches the mechanical layout requirements. Ensure the through-hole termination style is compatible with the target printed circuit board fabrication capabilities.

Headers, Male Pins Selection Notes

Select this component when a standard single-row header with right-angle exit is required. The 2.54 mm pitch ensures compatibility with common wire and board spacing standards. Consider the tin plating for cost-effective general use rather than high-cycle mating environments requiring gold finishes.

Headers, Male Pins Part Context

The TSW series represents classic PCB header strips manufactured by Samtec Inc. These components are widely used in various electronic systems for establishing reliable electrical connections between boards or cables. The TSW-135-25-T-S-RA variant specifically addresses needs for angled routing in dense layouts.

Headers, Male Pins Replacement Considerations

Cross-reference with other TSW series headers for different pin counts or orientations. Verify mechanical dimensions and electrical ratings against alternative suppliers' equivalent products to ensure functional interchangeability without redesigning the host assembly.