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TT175N16SOFHPSA1 is listed in the SCRs - Modules range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is SCR MODULE 1600V 275A MODULE. Review the specifications below when checking this part for your BOM.
The TT175N16SOFHPSA1 is a silicon thyristor module manufactured by Infineon Technologies, designed for high-power phase control applications. It features a screw mount installation style and operates within a junction temperature range of -40°C to +125°C. The device has a gate trigger current (Igt) of 150 mA and a maximum holding current (Ih) of 400 mA. This component belongs to the L#T-BOND module series, utilizing solder bond technology for reliable thermal and electrical connections in industrial power electronics systems.
Verify part authenticity through authorized Infineon distributors or certified partners. Confirm RoHS compliance status via official documentation before integration. Check for end-of-life notifications as discontinuance may affect long-term supply chain stability. Ensure storage conditions meet semiconductor handling standards to prevent moisture damage prior to assembly.
Select this module when high current capacity and reliable solder bond interconnects are required for phase control duties. Compare gate trigger current specifications against driver capabilities to ensure proper turn-on performance. Evaluate thermal resistance requirements against heatsink designs to maintain junction temperatures within the specified operational limits during continuous duty cycles.
This component is part of Infineon's broader portfolio of silicon thyristor modules, specifically engineered for demanding power electronics environments. It shares design lineage with other L#T-BOND series devices, offering standardized mounting interfaces and comparable electrical characteristics for scalable system design in industrial power conversion architectures.
TT190N16SOFHPSA2 is a confirmed substitute part number from Infineon Technologies. Verify pin compatibility and thermal interface dimensions before substitution. Ensure electrical parameters such as holding current and gate trigger thresholds align with existing circuit design constraints.
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