TX08DACP

Overview

The TX08DACP is an eight-channel ultrasound transmitter manufactured by Texas Instruments. It integrates a five-level pulser with on-chip beamforming, active transmit/receive (T/R) switches, and floating supplies within a single FCCSP-196 package. The device supports a maximum output voltage of ±100V and a peak current of 2A, with a mode supporting up to 4A. Key electrical parameters include a –3dB bandwidth of 20MHz at ±100V supply and 35MHz in the 4A mode. Integrated features include a high-speed LVDS serial interface for programming, internal temperature sensing, and error flag registers.

Feature Summary

• Eight-channel architecture with integrated five-level pulsers and active T/R switches
• On-chip beamformer with per-channel memory storing waveform and delay values
• High-voltage output capability: ±100V maximum with 2A standard or 4A support
• Low jitter performance: 100fs integrated jitter from 100Hz to 20kHz

Applications

• Ultrasound pulser imaging systems
• Piezoelectric driver circuits

Procurement Notes

Verify the specific orderable part number against the manufacturer's latest documentation before procurement. Confirm that the FCCSP-196 package dimensions and thermal requirements align with the target PCB layout. Ensure the design accounts for the high-voltage floating supplies and appropriate decoupling strategies required for the ±100V operation.

Selection Notes

Select this component for applications requiring multi-channel ultrasound transmission with integrated beamforming capabilities. Consider the 4A output mode if higher drive currents are necessary for specific transducer loads. Evaluate the 12mm x 12mm package size against available board space constraints. Verify compatibility with the 400MHz LVDS serial interface timing requirements.

Part Context

The TX08DACP belongs to the TX08D family of specialized ultrasound transmitters. It is designed as a complete solution for driving piezoelectric elements in medical imaging equipment. The 'ACP' suffix denotes the FCCSP-196 package type. This device consolidates functions typically distributed across multiple discrete components into a single integrated circuit.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Consult the manufacturer's official resources for potential alternatives or updated product recommendations.