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TXB0108YZPR2 is listed in the Translators, Level Shifters range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC TRANSLATOR BIDIR 20DSBGA. Review the specifications below when checking this part for your BOM.
The TXB0108YZPR2 is an 8-bit bidirectional voltage-level translator from Texas Instruments, designed for seamless communication between digital systems operating at different logic levels. It features auto-direction sensing to manage signal flow without external control pins. The device supports a wide supply voltage range on both sides, accommodating VCCA from 1.2V to 3.6V and VCCB from 1.65V to 5.5V. It offers a data rate of up to 100 Mb/s with a typical propagation delay of 4 ns. Packaged in a DSBGA-20 format, it includes ±15-kV ESD protection and operates within a temperature range of -40°C to +85°C.
Verify the specific suffix YZPR2 against the manufacturer's current datasheet to confirm package type and revision. Ensure compatibility with your board's thermal and electrical requirements before finalizing procurement. Cross-reference ordering information with official Texas Instruments documentation to avoid discrepancies in part identification or specifications.
Select this component when interfacing systems with distinct voltage domains, such as 1.2V/1.8V/2.5V/3.3V A-side to 1.65V/2.5V/3.3V/5V B-side. Consider the DSBGA-20 package constraints for PCB layout. Evaluate the 100 Mb/s speed limit against your system's clock requirements. Verify that the ±15-kV ESD rating meets your application's environmental standards.
This part belongs to the TXB0108 family of voltage-level translators. It shares core functionality with variants like TXB0108PWR and TXB0108YZPR but differs in packaging and potentially minor electrical characteristics. The family is characterized by its bidirectional nature and auto-direction sensing capabilities, making it suitable for various logic conversion tasks.
Direct substitutes include TXB0108YZPR and TXB0108NMER. Verify pinout compatibility and package dimensions (DSBGA-20 vs. NFBGA-20) before substitution. Check if alternative packages require re-layout adjustments. Confirm that electrical parameters such as propagation delay and supply voltage ranges remain within acceptable limits for your design.
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