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TZ100N484I3 is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Efinix, Inc.. Its product description is LINEAR IC. Review the specifications below when checking this part for your BOM.
The Efinix TZ100N484I3 is a Titanium FPGA featuring 92,534 logic elements and 6,880,000 total RAM bits. It includes 336 DSP blocks and supports 80 GPIOs within a 484-LFBGA package (18x18 mm). The device operates at a supply voltage of 0.92V to 0.98V and functions between 0°C and 85°C junction temperature. This component belongs to the Titanium series, designed for high-density programmable logic applications requiring significant embedded memory and digital signal processing capabilities in a surface-mount configuration.
Verify the specific suffix 'I3' against official Efinix documentation to confirm industrial temperature range compliance. Ensure the 484-ball BGA footprint matches the target PCB design constraints. Confirm RoHS3 status and moisture sensitivity level requirements prior to ordering. Cross-reference the manufacturer part number with authorized distributors to ensure authenticity and traceability.
Select this model when high logic density and extensive embedded RAM are required alongside DSP functionality. Compare resource utilization against smaller Titanium variants if cost or pin count is a constraint. Verify that the 484-pin package fits the mechanical envelope. Consider power consumption profiles relative to the 0.92V-0.98V operating voltage range for thermal management planning.
This component is part of the Efinix Titanium family, which targets high-performance FPGA applications. The Titanium series distinguishes itself through integrated hard processor subsystems and advanced interconnect architectures. The TZ100 designation indicates a specific tier within this lineup, balancing logic capacity with embedded memory depth for demanding digital designs.
Direct substitutes may include other Efinix Titanium models with similar logic counts, such as the TI90J484C3, though feature sets differ. Evaluate alternative vendors like Lattice or Xilinx only if architectural compatibility allows. Verify pin-to-pin compatibility and electrical characteristics before considering cross-vendor replacements.
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