UBA2037TS/N1,118

Overview

The UBA2037TS/N1,118 is a full bridge based MOSFET driver manufactured by NXP Semiconductors. It operates within a supply voltage range of up to 12 V and supports an extended operating temperature range from -40 °C to +125 °C. The component is housed in a 28-lead SSOP package with a body width of 5.3 mm. It features a single functional block designed for high-side driving applications and utilizes a plastic epoxy encapsulation material.

Feature Summary

• Full bridge based architecture for comprehensive MOSFET control
• Integrated high-side driver capability
• Industrial grade thermal performance supporting wide temperature operation

Applications

• High-side power switching circuits
• MOSFET gate drive interfaces
• Industrial motor control systems

Procurement Notes

Verify the exact suffix against official NXP documentation to confirm pinout compatibility and package dimensions. Ensure the selected variant matches the required thermal rating for your specific enclosure design. Cross-reference the ordering code with current manufacturer availability lists to avoid obsolete stock issues during production planning.

Selection Notes

Select this component when a robust full bridge driver is required for high-side applications. Consider the 28-pin SSOP footprint for PCB layout constraints. Verify that the 12 V supply requirement aligns with your system's power rails. Confirm that the industrial temperature range meets the environmental specifications of the target deployment location.

Part Context

This device belongs to NXP's analog mixed-signal interface portfolio, specifically categorized under drivers and controllers. It complements other power management solutions by providing precise gate drive signals for external MOSFETs. The series is designed to integrate seamlessly into complex power conversion topologies requiring reliable switching control.

Replacement Considerations

Check NXP datasheets for direct pin-compatible alternatives within the same family. Verify if newer revisions offer improved thermal characteristics or updated packaging options. Ensure any substitute maintains the same full bridge functionality and voltage ratings.