SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The UCC27200DRMT is a high-frequency half-bridge gate driver manufactured by Texas Instruments. It features a dual-channel configuration with independent high-side and low-side outputs housed in an 8-pin VSON package. The device supports a bootstrap voltage up to 120V and delivers a peak output current of 3A. It operates within a supply voltage range of 8V to 17V, ensuring robust performance for driving N-channel MOSFETs. Key electrical parameters include rise and fall times of 8ns and 7ns respectively, with propagation delays capped at 1ns. The component functions reliably across a junction temperature range of -40°C to +140°C.
Verify the specific suffix DRMT to confirm the 8-VSON (4x4) package type, as other suffixes indicate different form factors like SOIC-8 or ADRMR variants. Ensure compatibility with the target PCB footprint before ordering. Confirm that the required operating voltage and thermal management align with the specified 8V to 17V supply range and 140°C maximum junction temperature limits for reliable long-term operation.
Select this component when a compact surface-mount solution is required for high-side and low-side gate driving. The VSON package offers a smaller footprint compared to traditional SOIC options while maintaining similar electrical performance. Consider the 3A peak current capability for driving larger MOSFETs or multiple devices in parallel. Verify that the input logic levels are compatible with the controlling microcontroller or DSP signals.
This part belongs to the UCC27200 family of high-speed gate drivers designed for demanding power electronics applications. The DRMT suffix specifically denotes the VSON packaging variant, distinguishing it from the standard SOIC-8 version (UCC27200DR). This family is engineered for efficiency and speed, making it suitable for modern high-density power designs where space and switching losses are critical constraints.
The UCC27200DR is a direct pin-compatible alternative available in an SOIC-8 package. Designers must account for the physical size difference between the VSON and SOIC packages during board layout modifications. Electrical specifications remain largely consistent, but thermal dissipation characteristics may vary due to the distinct package geometries.