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The UCC2818APWR is a BiCMOS power factor preregulator controller designed for average current mode control. It operates within a switching frequency range of 6 kHz to 220 kHz and supports supply voltages between 12 V and 17 V. The device functions reliably across an operating temperature range of -40°C to +85°C. Packaged in a 16-pin PW (TSSOP) surface-mount housing, it features a typical supply current of 150 µA. This component integrates essential protection mechanisms and drive capabilities suitable for high-efficiency AC-DC conversion stages.
Verify the specific suffix 'PWR' confirms the TSSOP-16 package variant rather than the SOIC-16 configuration found in other series members. Confirm RoHS compliance status through the official datasheet as manufacturing updates may occur. Ensure the ordering part number matches the exact tape-and-reel or tube quantity requirements for your assembly line. Cross-reference the manufacturer date code to ensure compatibility with your current supply chain standards.
Select this component when average current mode control is required for improved line regulation and transient response compared to peak current modes. The wide operating frequency range allows optimization for both EMI performance and magnetic component size. Consider the low standby supply current for applications requiring minimal no-load power consumption. Verify that the thermal characteristics of the TSSOP package meet the thermal dissipation requirements of the target application environment.
This device belongs to the UCC2818 family of BiCMOS power factor preregulators from Texas Instruments. It shares core functional specifications with variants such as the UCC2818AD and UCC2818ADR, differing primarily in the physical package type. The family is engineered to provide high-performance power factor correction for universal AC input applications, serving as a critical stage in modern switched-mode power supplies.
The UCC2818AD serves as a pin-compatible alternative offering the same electrical functionality but housed in a 16-SOIC package instead of the TSSOP format. Designers must verify footprint compatibility and thermal management strategies when substituting between these package types. Other family members like the UCC2818AN offer through-hole options but require significant layout changes.