UCC2912DP

Overview

The UCC2912DP is a single-channel hot swap voltage controller manufactured by Texas Instruments, designed for programmable switch power management. It operates within a supply voltage range of 3 V to 8 V and supports an adjustable current limit up to 4 A. The device functions in an industrial temperature range from -40°C to +85°C and is housed in a 16-pin SOIC-Narrow package. It lacks integrated power failure detection capabilities.

Feature Summary

• Provides programmable control for hot swap applications with adjustable current limiting
• Supports negative floating input configurations for industrial environments
• Integrates undervoltage lockout (UVLO) for reliable startup sequencing

Applications

• Telecommunications equipment requiring -48V bus protection
• Industrial control systems needing board insertion management
• Computing infrastructure utilizing hot swap backplanes

Procurement Notes

Verify the specific suffix DP indicates the SOIC-16 package variant when sourcing. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Ensure design compatibility with the specified 3 V to 8 V operating voltage window. Validate thermal performance requirements against the -40°C to +85°C industrial rating for your intended environment.

Selection Notes

Select this component for applications requiring precise current limiting without internal switching elements. Compare against the UCC2913 series if higher voltage tolerance or different packaging is required. Consider the UCC2912PWP variant if a TSSOP-24 package with power failure detection features is preferred over the standard SOIC-16 configuration.

Part Context

This part belongs to the UCC2912 family of hot swap controllers from Texas Instruments. These devices are engineered to protect circuits during board insertion and removal. They manage inrush current and provide overload protection for downstream loads in critical power distribution networks.

Replacement Considerations

The UCC2912N serves as a DIP package alternative within the same functional family. Verify pinout compatibility before substitution. Cross-reference datasheets for minor parameter variations between package types.