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UCC37325DGN is listed in the Gate Driver range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC GATE DRVR LOW-SIDE 8MSOP. Review the specifications below when checking this part for your BOM.
The UCC37325DGN is a dual high-speed low-side power MOSFET driver from Texas Instruments, housed in an 8-pin MSOP PowerPAD package. It provides independent inverting and non-inverting outputs with a peak drive current of 4 A. The device operates on a supply voltage range of 4 V to 15 V and features typical rise and fall times of 23 ns. It draws a supply current of 600 uA and functions within a temperature range of 0°C to +70°C.
Verify the specific suffix 'RG4' against the manufacturer's latest documentation to confirm RoHS compliance status and lead time requirements. Ensure the MSOP PowerPAD thermal pad connection is properly managed in the PCB layout to maintain the specified thermal resistance and long-term reliability under load conditions.
Select this component when a dual-channel low-side driver with mixed logic polarity (one inverting, one non-inverting) is required. It is suitable for applications needing high peak current into capacitive loads without the complexity of bootstrap circuits associated with high-side drivers. Consider the thermal performance of the PowerPAD package for dense layouts.
This part belongs to the UCC3732x family of dual 4 A peak high-speed low-side power MOSFET drivers. It shares core electrical characteristics with variants like the UCC37323 and UCC37324 but differs in output configuration. The DGN suffix denotes the thermally enhanced 8-lead MSOP PowerPAD package designed to lower thermal resistance compared to standard SOIC packages.
UCC37323DGN offers dual inverting outputs. UCC37324DGN offers dual non-inverting outputs. UCC27325DGN is the automotive-grade equivalent. Verify pinout compatibility and thermal requirements before substitution.
The UCC37325 provides one inverting and one non-inverting output, whereas the UCC37323 provides two inverting outputs. Both share the same 4 A peak drive current and package options.
The MSOP PowerPAD package drastically lowers thermal resistance, improving long-term reliability by efficiently dissipating heat generated during high-current switching operations.
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