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UCC3803DG4 is listed in the DC DC Switching Controllers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC REG CTRLR MULT TOPOLOGY 8SOIC. Review the specifications below when checking this part for your BOM.
The UCC3803DG4 is a low-power BiCMOS current-mode PWM controller from Texas Instruments, designed for versatile power supply topologies including Boost, Buck, Flyback, and Forward configurations. It features a single output capable of sourcing 1 A drive current with a maximum duty cycle of 100%. The device operates at switching frequencies up to 1 MHz and supports an input supply voltage range of 3.6 V to 12 V. It is housed in an SOIC-8 surface-mount package and functions within a commercial temperature range of 0°C to +70°C.
Verify the specific suffix 'G4' indicates compliance with RoHS standards and manufacturing specifications as defined by Texas Instruments. Confirm that the SOIC-8 package variant matches your PCB footprint requirements. Ensure the operating temperature range of 0°C to +70°C aligns with your system's environmental conditions before finalizing procurement.
Select this component when a low-power, high-efficiency solution is required for non-isolated or isolated topologies. The 1 A drive strength suits moderate power levels without external gate drivers. Consider the 100% duty cycle feature for applications requiring continuous conduction mode or specific startup behaviors. Evaluate the 3.6 V minimum supply voltage against your available rail.
This part belongs to the UCC3803 series of low-power BiCMOS controllers. It serves as a core control element in various DC-DC conversion architectures. The DG4 designation specifies the SOIC-8 surface-mount package and lead-free construction. It complements other Texas Instruments power management ICs by providing robust current-mode control in a compact form factor.
The UCC3803DTRG4 is a tape-and-reel version of the same functional device. The UCC3803N is a through-hole PDIP-8 equivalent. Verify pinout compatibility and thermal performance when substituting between package types.
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