UCC3817NG4

Overview

The UCC3817NG4 is a BiCMOS power factor preregulator designed for continuous conduction mode (CCM) applications. It operates within a switching frequency range of 6 kHz to 220 kHz and supports a maximum operating supply voltage of 18 V. The device functions across an industrial temperature range of 0°C to +70°C. Key electrical characteristics include a startup current of 150 μA and an operating supply current of 4 mA. It is housed in a PDIP-16 package.

Feature Summary

• Implements BiCMOS technology for efficient power factor correction in single-phase applications.
• Supports continuous conduction mode (CCM) control strategies for improved performance.
• Features low startup current to minimize standby power consumption during initialization.

Applications

• Single-phase power factor correction circuits
• BiCMOS power factor preregulators
• Industrial power supplies requiring CCM operation

Procurement Notes

Verify the specific suffix 'G4' indicates lead-free compliance and RoHS adherence as per Texas Instruments standards. Confirm the PDIP-16 through-hole package matches your PCB footprint requirements. Ensure the 0 to +70°C commercial temperature grade aligns with your system's thermal design constraints before finalizing procurement.

Selection Notes

Select this component when a dedicated BiCMOS PFC controller is required for single-phase designs. The wide frequency range allows flexibility in passive component selection. Verify that the 18 V maximum supply voltage meets your input stage specifications. Consider the PDIP-16 package if through-hole assembly is mandated by your manufacturing process.

Part Context

This part belongs to the UCC3817 series from Texas Instruments, which focuses on power factor correction solutions. The 'G4' suffix typically denotes a green/RoHS-compliant variant of the standard UCC3817N. It serves as a specialized IC for improving efficiency in AC-DC conversion systems.

Replacement Considerations

The UCC3817AD is a pin-compatible SOIC-16 surface-mount alternative within the same family. Verify package compatibility and temperature ratings when substituting between DIP and SOIC variants.