UF2327L-202Y2R0-01

Overview

The UF2327L-202Y2R0-01 is a two-line common mode choke manufactured by TDK Corporation, designed for through-hole mounting. It features a current rating of 2A and a DC resistance of 150mOhm. The component operates within a temperature range of -20°C to +120°C and supports a DC voltage rating of 280V. It provides an insulation resistance of 100MΩ and withstands 2kV. This filter is RoHS compliant and lead-free.

Feature Summary

• Streamlined design for noise reduction in data lines
• Through-hole construction for secure board mounting
• Lead-free and RoHS compliant manufacturing

Applications

• Noise filtering in data transmission lines
• Common mode interference suppression in electronic circuits
• Signal integrity enhancement in high-speed digital interfaces

Procurement Notes

Verify the End-of-Life (EOL) status before procurement, as official sources indicate this specific part number may be discontinued. Confirm availability with authorized distributors or check for valid alternative components from TDK Corporation. Ensure the replacement meets the same electrical specifications and form factor requirements for your application.

Selection Notes

Select this component when a robust, through-hole common mode choke is required for 2A applications. Consider its 280V DC rating and wide operating temperature range for industrial or automotive environments. Verify that the physical dimensions fit the PCB layout constraints and that the EOL status does not impact long-term production viability.

Part Context

This component belongs to TDK's line of common mode chokes and filters. TDK Corporation is a global electronics manufacturer known for ferrite materials and magnetic components. The UF2327L series is engineered for electromagnetic interference suppression in various electronic systems requiring reliable signal filtering.

Replacement Considerations

Check for official TDK alternatives if this part is discontinued. Ensure substitutes match the 2A current rating, 2-line configuration, and through-hole package type. Verify compatibility with existing PCB footprints and electrical performance requirements.