UJA1131HW/3V3Y

UJA1131HW/3V3Y

  • Description:IC TRANSCEIVER
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:ff3a89823e6f Category: Brand:

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Product Detailed Parameters

  • Description:IC TRANSCEIVER
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Applications:-
  • Current - Supply:2.8mA
  • Voltage - Supply:2V ~ 28V
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:48-TQFP Exposed Pad
  • Supplier Device Package:48-HTQFP (10x10)
  • Grade:Automotive
  • Qualification:AEC-Q100

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UJA1131HW/3V3Y

Overview

The UJA1131HW/3V3Y is a System Basis Chip (SBC) from NXP USA Inc., designed for in-vehicle networking. It integrates an automatic SMPS Buck-Boost converter, a High-Speed CAN transceiver, and up to two LIN transceivers. The device operates within a supply voltage range of 2V to 28V and features a typical supply current of 2.8mA. It is housed in a 48-HTQFP package with dimensions of 10x10 mm and includes exposed pads. The component supports an operating temperature range of -40°C to 125°C TA and holds AEC-Q100 automotive qualification.

Feature Summary

  • Integrates a fully automatic SMPS Buck-Boost converter for efficient power management
  • Combines High-Speed CAN transceiver capabilities with support for up to two LIN transceivers
  • Designed specifically for automotive applications with AEC-Q100 qualification

Applications

  • In-vehicle networking systems requiring integrated power and communication
  • Automotive electronic control units utilizing HS-CAN and LIN protocols
  • Power management solutions for automotive microcontrollers

Procurement Notes

Verify the specific suffix '3V3Y' against official NXP documentation to confirm pinout and feature configuration, as variations exist within the UJA113x family. Note that this part status is listed as obsolete; ensure availability through authorized channels or approved alternatives before finalizing design-in decisions.

Selection Notes

Select this component when a single-chip solution for HS-CAN and dual LIN communication with integrated buck-boost power regulation is required. Ensure the 48-HTQFP package fits the PCB layout constraints and verify that the 2V-28V input range matches the vehicle's electrical system specifications.

Part Context

This component belongs to the UJA113x HW series of System Basis Chips from NXP Semiconductors. These SBCs are engineered to simplify automotive network designs by combining essential power management and transceiver functions into a compact form factor, reducing board space and assembly complexity for modern vehicle architectures.

Replacement Considerations

NXP recommends the UJA1135AHW/3/0Y as a manufacturer-recommended substitute. Verify compatibility regarding package type and functional specifications before replacement.

UJA1131HW/3V3YUJA1131HW/3V3Y

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