UJA1131HW/FD/3V/4Y

Description：BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Series：-
Mfr：NXP USA Inc.
Package：Tape & Reel (TR),Cut Tape (CT)

SKU:48d0b288b5ae Category: Power Management - Specialized Brand: NXP USA Inc.

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Product introduction

Product Detailed Parameters

Description：BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Series：-
Mfr：NXP USA Inc.
Package：Tape & Reel (TR),Cut Tape (CT)
Applications：-
Current - Supply：2.8mA
Voltage - Supply：2V ~ 28V
Operating Temperature：-40°C ~ 125°C (TA)
Mounting Type：Surface Mount
Package / Case：48-TQFP Exposed Pad
Supplier Device Package：48-HTQFP (10x10)
Grade：Automotive
Qualification：AEC-Q100

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UJA1131HW/FD/3V/4Y

Overview

The UJA1131HW/FD/3V/4Y is an automotive-grade System Basis Chip (SBC) manufactured by NXP USA Inc. It integrates a Buck-boost converter with High-Speed CAN and dual LIN transceivers for in-vehicle networking. The device operates within a supply voltage range of 2V to 28V and supports a supply current of 2.8mA. It is qualified to AEC-Q100 standards and functions across a temperature range of -40°C to 125°C TA. The component is housed in a 48-HTQFP package with dimensions of 10x10 mm.

Feature Summary

Integrates a buck-boost power stage with high-speed CAN and dual LIN transceivers
Designed for robust in-vehicle networking applications
Automotive grade qualification ensuring reliability under harsh conditions

Applications

In-vehicle network systems requiring combined power management and communication
Automotive electronic control units utilizing HS-CAN and LIN interfaces
Power distribution and signal processing in automotive environments

Procurement Notes

Verify the specific suffix 'FD/3V/4Y' against official NXP documentation to confirm pinout, packaging, and electrical characteristics. Confirm end-of-life status and availability of recommended replacements such as the UJA1131AHW series if sourcing new production units is required.

Selection Notes

Select this component when a single-chip solution for power regulation and multi-protocol communication is needed. Ensure the design accommodates the 48-HTQFP footprint and thermal requirements. Verify compatibility with the target microcontroller's voltage levels and bus speeds before integration.

Part Context

This part belongs to the UJA113xHW family of system basis chips from NXP Semiconductors. These devices are engineered to simplify automotive electronics design by combining power management with essential communication interfaces. The family targets modern vehicle architectures demanding efficient power usage and reliable data transmission.