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Product Detailed Parameters
- Description：BUCK/BOOST HS-CAN/DUAL LIN SYSTE
- Series：-
- Mfr：NXP USA Inc.
- Package：Tape & Reel (TR),Cut Tape (CT)
- Applications：-
- Current - Supply：2.8mA
- Voltage - Supply：2V ~ 28V
- Operating Temperature：-40°C ~ 125°C (TA)
- Mounting Type：Surface Mount
- Package / Case：48-TQFP Exposed Pad
- Supplier Device Package：48-HTQFP (10x10)
- Grade：Automotive
- Qualification：AEC-Q100
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Overview
The UJA1131HW/FD/5V/4Y is an automotive-grade System Basis Chip (SBC) from NXP Semiconductors. It integrates a buck and boost converter with HS-CAN and dual LIN transceivers for in-vehicle networking. The device operates on a supply voltage of 2V to 28V and draws a typical supply current of 2.8mA. It is qualified to AEC-Q100 standards and functions within a temperature range of -40°C to 125°C TA. The component is housed in a 48-HTQFP package with exposed pad.
Feature Summary
- Integrates fully integrated buck and boost converters for efficient power management
- Combines HS-CAN and dual LIN transceivers for robust vehicle communication
- Automotive grade qualification ensuring reliability in harsh environments
Applications
- In-vehicle networking systems requiring combined power and communication
- Automotive electronic control units (ECUs)
- Body control modules integrating CAN and LIN interfaces
Procurement Notes
This specific part number is officially listed as obsolete and end-of-life by the manufacturer. Verification of availability should focus on alternative sources or replacement components rather than direct procurement. Confirm that any substitute parts meet the same AEC-Q100 and functional requirements before integration into designs.
Selection Notes
Select this component only if legacy compatibility is required, as it is discontinued. For new designs, evaluate current NXP SBC offerings that provide similar buck/boost conversion and multi-interface capabilities. Ensure the selected replacement supports the necessary HS-CAN and dual LIN specifications while maintaining automotive qualification standards.
Part Context
The UJA1131 series belongs to NXP's portfolio of System Basis Chips designed for automotive applications. These devices consolidate power management and communication interfaces into a single package, reducing board space and complexity. The HW variant typically denotes specific packaging and thermal characteristics suitable for high-performance automotive electronics.
Replacement Considerations
NXP recommends the UJA1131AHW/5/0Y as a manufacturer-recommended substitute. Verify pinout compatibility and electrical specifications before substitution.
