UJA1132HW/5V0/S9AY

UJA1132HW/5V0/S9AY

  • Description:IC SBCS CAN HIGH SPEED 48HTQFP
  • Series:*
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)

SKU:da2cf0cfc146 Category: Brand:

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Product Detailed Parameters

  • Description:IC SBCS CAN HIGH SPEED 48HTQFP
  • Series:*
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)
  • Applications:-
  • Current - Supply:-
  • Voltage - Supply:-
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Grade:-
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UJA1132HW/5V0/S9AY

Overview

The UJA1132HW/5V0/S9AY is a System Basis Chip (SBC) from NXP Semiconductors, designed for automotive applications requiring integrated power management and communication. It features a fully integrated automatic SMPS Buck-Boost converter, a High-Speed CAN transceiver, and up to two LIN transceivers. The device supports advanced power control with under-voltage and over-temperature protection. It enables wake-up via CAN or local signals, facilitating efficient system operation in complex vehicle networks.

Feature Summary

  • Integrates an automatic SMPS Buck-Boost converter for efficient power regulation
  • Includes a High-Speed CAN transceiver for robust network communication
  • Supports up to two LIN transceivers for additional local interconnect capabilities
  • Provides under-voltage and over-temperature protection for system reliability

Applications

  • Automotive body electronics systems
  • Vehicle gateway modules
  • Integrated power distribution units
  • Smart junction boxes

Procurement Notes

Verify the exact part number suffix S9AY against the manufacturer's current ordering guide to ensure correct packaging and tape-and-reel specifications. Confirm RoHS compliance status as per the latest environmental declarations. Check for any product change notices (PCN) regarding obsolescence or pinout modifications before finalizing procurement orders.

Selection Notes

Select this component when a single-chip solution combining high-speed CAN, dual LIN, and buck-boost power conversion is required. Ensure the application voltage range aligns with the integrated converter's capabilities. Consider the HTQFP package size constraints during PCB layout design. Verify that the thermal performance meets the specific enclosure requirements of the target assembly.

Part Context

This part belongs to the UJA113x family of System Basis Chips, which are designed to simplify automotive electronic architecture by integrating multiple functions into one package. The family typically includes variants with different transceiver combinations and power stages, allowing designers to tailor the solution to specific network topologies and power budgets without compromising on integration density.

Replacement Considerations

Direct replacements may include other UJA113x variants such as UJA1134 or UJA1136, depending on the required LIN channel count and power stage specifications. Cross-reference with NXP's official substitution matrix to ensure functional compatibility. Verify that any substitute part maintains the same package footprint and pinout configuration to avoid redesign efforts.

UJA1132HW/5V0/S9AYUJA1132HW/5V0/S9AY

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