UJA1132HW/FD/3V/0Y

UJA1132HW/FD/3V/0Y

$5.96
  • Description:BUCK/BOOST HS-CAN/DUAL LIN SYSTE
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:247f56d2fe6a Category: Brand:

  
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Product Detailed Parameters

  • Description:BUCK/BOOST HS-CAN/DUAL LIN SYSTE
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Applications:-
  • Current - Supply:2.8mA
  • Voltage - Supply:2V ~ 28V
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:48-TQFP Exposed Pad
  • Supplier Device Package:48-HTQFP (10x10)
  • Grade:Automotive
  • Qualification:AEC-Q100

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UJA1132HW/FD/3V/0Y

Overview

The UJA1132HW/FD/3V/0Y is a system basis chip integrating a buck-boost converter, HS-CAN transceiver, and dual LIN transceivers. It operates within a supply voltage range of 2V to 28V and supports an operating temperature range of -40°C to 125°C (TA). The device features a current supply of 2.8mA and utilizes an HTQFP-48 (10x10) package. This component is designed for automotive applications requiring robust power management and multi-network communication capabilities.

Feature Summary

  • Integrates fully integrated buck and boost converters for efficient power regulation
  • Combines high-speed CAN and dual local interconnect network transceivers
  • Includes built-in low-dropout regulator with overcurrent protection

Applications

  • Automotive body control modules
  • Gateway systems requiring mixed network protocols
  • Powertrain control units

Procurement Notes

Verify the specific suffix configuration against official NXP documentation, as variations exist in voltage and packaging options. Confirm end-of-life status or obsolescence through authorized distributors before procurement planning. Ensure compatibility with existing board layouts regarding the HTQFP-48 package dimensions and thermal requirements.

Selection Notes

Select this component when a single IC solution is required to manage power conversion alongside both high-speed CAN and dual LIN communications. Consider the wide input voltage range and extended temperature specifications for harsh automotive environments. Evaluate the integration benefits against discrete solutions to reduce bill of materials and board space.

Part Context

This part belongs to the UJA113x series of system basis chips from NXP Semiconductors. These devices are engineered to simplify automotive electronic design by combining essential power management and communication interfaces into a compact form factor, reducing complexity in vehicle network architectures.

Replacement Considerations

Check for direct pin-to-pin compatible alternatives within the UJA113x family that may have updated lifecycle statuses. Verify functional equivalence regarding voltage ranges and protocol support if substituting with other manufacturers' system basis chips.

UJA1132HW/FD/3V/0YUJA1132HW/FD/3V/0Y
$5.96
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