UJA1132HW/FD/3V/4Y

UJA1132HW/FD/3V/4Y

  • Description:BUCK/BOOST HS-CAN/DUAL LIN SYSTE
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:59541aad1d31 Category: Brand:

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Product Detailed Parameters

  • Description:BUCK/BOOST HS-CAN/DUAL LIN SYSTE
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Applications:-
  • Current - Supply:2.8mA
  • Voltage - Supply:2V ~ 28V
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:48-TQFP Exposed Pad
  • Supplier Device Package:48-HTQFP (10x10)
  • Grade:Automotive
  • Qualification:AEC-Q100

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UJA1132HW/FD/3V/4Y

Overview

The UJA1132HW/FD/3V/4Y is a System Basis Chip (SBC) from NXP Semiconductors, designed for automotive applications. It integrates a fully integrated buck and boost converter with HS-CAN and dual LIN transceivers. The device operates within a supply voltage range of 2V to 28V and supports an operating temperature range of -40°C to 125°C. It features built-in LDO regulation and overcurrent protection. The component is housed in an SOT1181-2 package and has a typical supply current of 2.8mA.

Feature Summary

  • Integrates buck and boost converters with HS-CAN and dual LIN transceivers
  • Includes built-in LDO regulator for stable internal power supply
  • Provides overcurrent protection for enhanced system reliability

Applications

  • Automotive body control modules
  • Door control units
  • Seat adjustment systems

Procurement Notes

Verify the specific suffix 'FD/3V/4Y' against official NXP documentation to ensure correct pinout and electrical characteristics. Confirm RoHS compliance status as indicated in the datasheet. Check for End-of-Life status or obsolescence notices before procurement planning. Ensure the ordering quantity matches the minimum reel requirements specified by the manufacturer.

Selection Notes

Select this component when a combined solution for power management and high-speed CAN communication with additional LIN capability is required. Consider the integrated buck/boost topology for flexible input voltage handling in automotive environments. Evaluate the thermal performance within the specified -40°C to 125°C range for your specific enclosure design.

Part Context

This part belongs to the UJA113x series of System Basis Chips. These chips are designed to reduce board space and simplify design by integrating multiple functions into a single package. The series typically includes variations with different transceiver types and voltage regulators to suit various automotive network architectures.

Replacement Considerations

Check for direct substitutes within the UJA113x family that may have updated suffixes or revised specifications. Verify compatibility with existing PCB layouts and software configurations if replacing with a similar NXP SBC.

UJA1132HW/FD/3V/4YUJA1132HW/FD/3V/4Y

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