UJA1132HW/FD/5V/4Y

UJA1132HW/FD/5V/4Y

$6.43
  • Description:BUCK/BOOST HS-CAN/DUAL LIN SYSTE
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:ed392c91ec70 Category: Brand:

  
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Product Detailed Parameters

  • Description:BUCK/BOOST HS-CAN/DUAL LIN SYSTE
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Applications:-
  • Current - Supply:2.8mA
  • Voltage - Supply:2V ~ 28V
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:48-TQFP Exposed Pad
  • Supplier Device Package:48-HTQFP (10x10)
  • Grade:Automotive
  • Qualification:AEC-Q100

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UJA1132HW/FD/5V/4Y

Overview

The UJA1132HW/FD/5V/4Y is a specialized power management IC from NXP Semiconductors, classified as a Buck/Boost HS-CAN/Dual LIN System Basis Chip. It integrates a buck/boost converter for DC-DC conversion alongside communication interfaces. The device features a High-Speed CAN interface supporting data rates up to 1 Mbps and dual LIN interfaces with maximum data rates of 20 kbps. This integration allows for efficient power distribution and robust network connectivity in automotive applications.

Feature Summary

  • Integrates a buck/boost converter for efficient DC-DC voltage regulation within the system basis chip architecture.
  • Provides a High-Speed CAN interface capable of operating at data rates up to 1 Mbps for reliable automotive communication.
  • Includes dual LIN interfaces to support multiple local interconnect network connections simultaneously.

Applications

  • Automotive body electronics systems requiring integrated power and communication management
  • Vehicle networks utilizing High-Speed CAN protocols for data transmission
  • Systems incorporating Dual LIN bus architectures for peripheral control

Procurement Notes

Verify the specific suffix FD/5V/4Y against official NXP documentation to confirm pinout and packaging details. Ensure compatibility with existing PCB layouts and thermal requirements. Confirm lifecycle status as obsolete or end-of-life through authorized distributors before finalizing procurement plans.

Selection Notes

Select this component when a combined solution for DC-DC conversion and high-speed CAN/LIN communication is required. Evaluate the need for dual LIN channels versus single channel variants. Consider the HTQFP package dimensions and thermal performance relative to the application's power dissipation constraints.

Part Context

This part belongs to the UJA1132 family of System Basis Chips designed for automotive environments. These chips consolidate power management and transceiver functions into a single package to reduce board space and complexity. The HW variant typically denotes specific package and temperature characteristics defined by NXP.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided source material. Verify if other suffixes within the UJA1132 series offer equivalent functionality or if alternative system basis chips from NXP are recommended for current designs.

UJA1132HW/FD/5V/4YUJA1132HW/FD/5V/4Y
$6.43
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