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— IC芯片 | 连接器 | 传感器 | 被动器件 —
The UJA1136HW/3V3Y is a System Basis Chip (SBC) designed for automotive applications, integrating power management and transceiver functions. It features a fully integrated buck and boost converter alongside HS-CAN and dual LIN transceivers. The device operates within a supply voltage range of 2V to 28V and supports an operating temperature range of -40°C to 125°C TA. It consumes a typical supply current of 2.8mA and is housed in a 48-HTQFP (10x10) package with exposed pad.
Verify the exact part marking and datasheet revision against NXP official documentation before procurement. Confirm that the HTQFP-48 package dimensions match your PCB footprint requirements. Ensure compatibility with your vehicle's electrical system specifications, particularly regarding the 2V to 28V input range and thermal performance at maximum ambient temperatures.
Select this component when a combined solution for power conversion and multi-protocol communication is required. It is suitable for designs needing both high-speed CAN and dual LIN interfaces within a single integrated circuit. Consider the thermal dissipation capabilities of the 48-pin HTQFP package for your specific enclosure constraints.
This component belongs to the NXP UJA113x series of System Basis Chips. These devices are engineered to simplify automotive electronics by combining power management and communication interfaces. The series targets modern vehicle architectures demanding high integration levels and robust performance under harsh environmental conditions.
Check NXP documentation for direct pin-to-pin replacements or recommended alternatives within the UJA113x family. Verify functional equivalence if substituting with other SBCs, ensuring compatible voltage ranges and interface protocols.