ULP-70+

Overview

The ULP-70+ is a lumped LC low-pass filter designed for surface mount applications. It provides a cutoff frequency of 70 MHz with a nominal impedance of 50 Ohms. The device operates from DC to the specified cutoff point, ensuring effective signal conditioning in RF systems. It features an insertion loss of 2 dB and is housed in a compact 6-SMD module package.

Feature Summary

• Lumped LC architecture for stable filtering performance
• Surface mount design for automated assembly integration
• 50 Ohm impedance matching for standard RF environments

Applications

• RF signal conditioning circuits
• Base station front-end filtering
• Test and measurement equipment input stages

Procurement Notes

Verify the specific manufacturer datasheet for the ULP-70+ to confirm pinout configurations and thermal handling requirements. Ensure compatibility with 50 Ohm system impedance before integration. Check for RoHS compliance status if required by project specifications. Confirm surface mount footprint dimensions against PCB layout constraints.

Selection Notes

Select this component when a sharp cutoff near 70 MHz is required in a limited space. The 6-SMD package suits high-density boards. Consider the 2 dB insertion loss impact on overall system gain. Verify that the lumped LC topology meets harmonic rejection needs compared to distributed alternatives.

Part Context

Mini-Circuits manufactures this component as part of its broad portfolio of RF and microwave signal processing devices. The company specializes in components ranging from DC to high-frequency ranges, serving industries requiring reliable signal integrity solutions.

Replacement Considerations

Consult official Mini-Circuits documentation for direct cross-reference part numbers. Verify electrical parameters such as cutoff frequency and impedance match exactly before substitution.