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The ULQ2004AN is a high-voltage, high-current Darlington transistor array manufactured by Texas Instruments. It integrates seven open-collector Darlington pairs with common emitters within a single package. Each channel supports an output current of 500 mA and can withstand peak currents up to 600 mA. The device features an output voltage rating of 50 V and includes integrated suppression diodes for inductive load driving. It operates within an extended temperature range from -40°C to 105°C. The component utilizes a 16-pin plastic DIP package with a copper lead-frame to minimize thermal resistance.
Verify the specific manufacturer source when sourcing this component, as STMicroelectronics also produces the ULQ2004A variant. Confirm that the part number suffix 'AN' corresponds to the Texas Instruments designation for the 16-pin DIP package. Ensure the procurement documentation explicitly identifies Texas Instruments as the producer to distinguish it from other manufacturers offering similar Darlington arrays.
Select the ULQ2004AN when a design requires multiple high-current switching channels in a through-hole configuration. The 500 mA per channel rating makes it suitable for direct drive of moderate loads without external transistors. Consider the 16-pin DIP footprint for prototyping or legacy board designs. Verify that the 50 V collector-emitter voltage meets the maximum load requirements of the application.
The ULQ2004AN belongs to the ULQ200x series of high-voltage Darlington arrays. This family includes variants such as the ULQ2001, ULQ2003, and ULQ2004, which share similar internal architectures but may differ in specific electrical characteristics or packaging options. The ULQ2004AN specifically denotes the Texas Instruments version housed in a standard 16-lead dual in-line package.
The ULN2003AN serves as a functional substitute within the same product family. Both components offer seven Darlington pairs and similar switching capabilities. Verify that the replacement part matches the required package type and thermal performance specifications for the target application.