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The UM4611 is a four-function data line filter manufactured by Union Semiconductor International Limited. It operates within an ambient temperature range of -40°C to +85°C and features a cutoff frequency of 150MHz with a capacitance value of 15pF. The device utilizes a third-order filter architecture and is housed in an eight-pin plastic package. Designed as an LC low-pass filter array, it integrates transient voltage suppression diodes to manage signal integrity and protect against electrical disturbances.
Verify the manufacturer designation as Union Semiconductor International Limited or Union Semiconductor (HK) Limited on official documentation. Confirm the part number UM4611 matches the specified eight-pin plastic package and 150MHz cutoff frequency. Ensure compliance with RoHS standards if required by your assembly specifications. Cross-reference datasheet revisions to confirm pinout consistency before integration into final designs.
Select this component when simultaneous EMI filtering and ESD protection are required for low-voltage digital interfaces. The 150MHz cutoff frequency suits high-speed data lines where signal attenuation must be minimized above the operating band. The integrated TVS capability reduces bill-of-materials count by eliminating separate protection devices. Verify that the 15pF capacitance aligns with the impedance matching requirements of the connected display interface.
This component belongs to a family of LC low-pass filter arrays that include models such as the UM4601, UM8601, and UM8611. These devices share the common design philosophy of combining passive filtering with active protection mechanisms. The UM4611 specifically addresses four-line configurations, distinguishing it from single or dual-line variants within the same product series offered by Union Semiconductor.
Publicly confirmed substitute part numbers are not available in the provided documentation. Evaluate functional equivalents based on identical pin counts, cutoff frequencies, and integrated TVS specifications. Verify compatibility with existing PCB footprints and thermal requirements before substituting.