UMX1089SM

Overview

The UMX1089SM is a silicon PIN diode manufactured by Microchip Technology. It features a hermetic MELF package designed for high-reliability applications. The device operates with a reverse voltage rating of 75 V and supports a maximum power dissipation of 1 W. It functions within a temperature range from -65°C to +150°C, ensuring stability in extreme environments. The component utilizes single configuration technology with an inverse current specification of 50 nA.

Feature Summary

• Hermetic sealing provides enhanced protection against environmental factors and moisture ingress.
• Silicon PIN construction ensures stable performance under high-frequency switching conditions.
• Wide thermal operating range supports deployment in demanding industrial and military settings.

Applications

• High-reliability RF switching circuits
• Attenuator networks requiring precise control
• Military and aerospace electronic systems

Procurement Notes

Verify the specific ordering suffix to confirm the hermetic MELF package variant. Ensure that procurement channels source directly from authorized distributors to guarantee authenticity. Confirm RoHS compliance status if required by project specifications. Validate that the supplier provides official datasheets matching the part number. Check for any specific handling requirements related to hermetic components during assembly.

Selection Notes

Select this component when hermetic sealing is mandatory for long-term reliability. Consider the 75 V reverse voltage limit for circuit design constraints. Evaluate the 1 W power dissipation capability against thermal management requirements. Compare the -65°C to +150°C operating range with environmental exposure levels. Assess the need for silicon PIN diode characteristics in signal processing applications.

Part Context

This part belongs to Microchip Technology's discrete semiconductor portfolio, specifically within the PIN diode category. It complements other high-reliability components used in critical infrastructure. The hermetic variant distinguishes it from standard plastic surface-mount options. It serves as a specialized solution for applications where standard packaging fails to meet durability standards.

Replacement Considerations

Direct substitutes include the non-hermetic UMX1089-GM2, though package differences apply. Verify electrical parameters match before substitution. Hermetic equivalents may require specific mounting considerations. Consult official cross-reference lists for approved alternatives.

FAQ

What is the package type for the UMX1089SM?

The UMX1089SM utilizes a hermetic MELF (Metal Electrode Leadless Face) package.

Is the UMX1089SM suitable for high-temperature environments?

Yes, it supports a maximum operating temperature of +150°C.