UPS5817/TR13

Single Diodes Overview

The UPS5817/TR13 is a small-signal Schottky rectifier manufactured by Microchip Technology. It utilizes the POWERMITE surface-mount package for efficient energy conversion. Key electrical specifications include a maximum repetitive peak reverse voltage of 20 V and a forward current rating of 1 A. The device features a low forward voltage drop, typically 0.45 V at rated current, ensuring minimal power loss. It is designed for high-speed switching applications requiring fast turn-on characteristics.

Single Diodes Feature Summary

• Low forward voltage drop for effective energy conversion
• Fast turn-on capability suitable for high-frequency switching
• Surface mount POWERMITE package design

Single Diodes Applications

• High-frequency rectification circuits
• Power supply output stages
• DC-DC converter freewheeling diodes

Single Diodes Procurement Notes

Verify the specific suffix TR13 indicates tape-and-reel packaging when sourcing. Confirm the manufacturer is Microchip Technology to ensure component authenticity. Check RoHS compliance status as required by project specifications. Ensure the POWERMITE footprint matches the PCB layout constraints before finalizing procurement orders.

Single Diodes Selection Notes

Select this component for applications requiring a 20 V reverse voltage rating with a 1 A continuous forward current capacity. The low forward voltage characteristic makes it suitable for low-voltage, high-efficiency power designs. Consider the surface mount POWERMITE package for automated assembly processes where space efficiency is critical.

Single Diodes Part Context

This part belongs to the Microchip Technology Schottky Diodes & Rectifiers product line. It is a surface-mount variant of the standard 1N5817 series, adapted for modern PCB assembly techniques. The device serves as a replacement for through-hole equivalents in compact electronic designs requiring reliable rectification performance.

Single Diodes Replacement Considerations

The 1N5817 is a related through-hole equivalent from the same family. Verify pinout compatibility and thermal dissipation requirements when substituting between surface mount and through-hole packages.