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VS-C04ET07T-M3 is listed in the Single Diodes range at ChipApex. The manufacturer field lists Vishay General Semiconductor - Diodes Division. Its product description is DIODE SIL CARB 650V 4A TO220AC. Review the specifications below when checking this part for your BOM.
The VS-C04ET07T-M3 is a silicon carbide Schottky diode manufactured by Vishay General Semiconductor - Diodes Division. It features a single configuration housed in a TO-220AC-2 through-hole package. The device supports a maximum repetitive reverse voltage of 650 V and an average forward current of 4 A. Key electrical parameters include a forward voltage of 1.33 V at the rated current, a peak forward surge current capability of 125 A, and a reverse leakage current of 110 uA. It operates within a junction temperature range of -55 C to +175 C.
Verify the specific suffix M3 indicates RoHS compliance when sourcing. Confirm the package type matches the required TO-220AC-2 footprint for your PCB design. Ensure the 650V rating aligns with your circuit's peak inverse voltage requirements. Check for any specific handling instructions regarding the silicon carbide material properties during assembly.
Select this component for applications requiring low forward voltage drop and high thermal efficiency compared to traditional silicon diodes. The 4A current rating suits moderate power levels where size constraints favor through-hole mounting. Consider the 650V blocking voltage for standard industrial and commercial power supply designs.
This part belongs to Vishay's silicon carbide Schottky diode lineup, designed for demanding power electronics environments. The SiC technology enables higher switching frequencies and reduced heat dissipation needs. The TO-220AC-2 package provides a balance of thermal management and mechanical stability for board-mounted implementations.
Consult official Vishay documentation for direct cross-references. Verify that any substitute maintains the 650V rating, 4A current capacity, and TO-220AC-2 package dimensions to ensure compatibility without redesigning the heatsink or PCB layout.
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