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— IC芯片 | 连接器 | 传感器 | 被动器件 —
The VSC3316HDMIEV is an evaluation board for the Microsemi VSC3316, a 11.5 Gbps 16 × 16 crosspoint switch IC. The device supports DC to 11.5 Gbps NRZ data rates per channel with a 2.5 V power supply. It features a fully non-blocking and multicasting switch core with less than 1 ns latency. Key specifications include 26 dB of input equalization and 9 dB of pre-emphasis. The package is a 15 mm × 15 mm flip chip ball grid array.
Verify the specific revision level of the VSC3316HDMIEV hardware against the latest datasheet documentation. Confirm that the included firmware or configuration files match the intended protocol requirements. Ensure proper ESD handling procedures are followed during inspection. Check for any required external components not included in the kit. Validate compatibility with existing test fixtures before deployment.
Select this evaluation platform when validating high-speed copper interconnect designs requiring up to 11.5 Gbps per channel. It is suitable for testing protocol-transparent switching in storage and server environments. Use it to characterize equalization performance for long-reach applications. It aids in verifying LOS detection and forwarding capabilities. Ideal for prototyping broadcast video routing solutions.
This evaluation module utilizes the VSC3316 integrated circuit, which belongs to Microsemi's family of multichannel crosspoint switches. The underlying chip provides a cost-effective solution for high-density system interconnects. It addresses channel impairments through fourth-generation I/O capability. The component serves as a building block for complex switching architectures.
No direct public substitute part numbers are documented for this specific evaluation board model. The VSC3316 IC itself may have newer revisions; verify if updated silicon versions offer improved electrical characteristics. Consult manufacturer documentation for legacy support status.