VSC9295YSM

VSC9295YSM

  • Description:IC TSI SWITCH 1072FCBGA
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tray

SKU:2bbe3b1476b3 Category: Brand:

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Product Detailed Parameters

  • Description:IC TSI SWITCH 1072FCBGA
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tray
  • Type:TSI - Time Slot Interchange Switch
  • Circuit:-
  • Independent Circuits:-
  • Current - Output High, Low:-
  • Voltage Supply Source:Dual Supply
  • Voltage - Supply:+2.5V/1.2V
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:1072-FCBGA
  • Supplier Device Package:1072-FCBGA

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VSC9295YSM

Overview

The VSC9295YSM is a Time-Slot Interchange (TSI) switch IC from Microchip Technology, featuring a 136 x 136 port configuration. It delivers an aggregate bandwidth of 340 Gbps and supports dual-rate TFI-5 compliant interfaces operating at 2.5 Gbps and 622 Mbps. The device utilizes a dual power supply architecture with maximum voltages of 1.2 V and 2.5 V. It is housed in a 45.0 mm 1072 fcBGA package designed for surface mount installation.

Feature Summary

  • Supports fully nonblocking STS-1 switching matrix with integrated clock recovery and synthesis
  • Provides serial backplane interfaces with input equalization and output pre-emphasis
  • Includes SONET/SDH compliant scrambling, framing, deskewing, and alarm detection capabilities
  • Features ports for dropping and inserting overhead bytes alongside a multimode CPU interface

Applications

  • Core and Metro Networks
  • DWDM Switches
  • Central Switch in 170 Gbps to 340 Gbps STS-1 Grooming Fabric
  • Switch Element for 680 Gbps to 1.36 Tbps STS-1 Grooming Fabric

Procurement Notes

Verify component authenticity through authorized Microchip distributors or direct channels. Confirm the specific suffix matches the required package and temperature grade. Review the latest datasheet for any specification updates or lifecycle changes before finalizing procurement plans.

Selection Notes

Select this component for high-capacity TDM switching requiring 340 Gbps throughput. Ensure system design accommodates the dual voltage requirements and the large 1072-pin BGA footprint. Evaluate thermal management strategies given the typical power dissipation specifications.

Part Context

This part belongs to the Vitesse Semiconductor family of telecom interface ICs, now under Microchip Technology. It serves as a high-density solution for optical transport networks, enabling scalable architectures for SONET/SDH systems while optimizing development resources through hardware and software standardization.

Replacement Considerations

The VSC9292 offers a 68 x 68 configuration with 170 Gbps bandwidth. Verify pin compatibility and performance requirements when considering cross-model substitution within the same product family.

VSC9295YSMVSC9295YSM

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